Venue
Hotel Olive Tree, Penang, Malaysia
ADVANCED PACKAGING
Advanced electronic packaging is a vital technology that enables the integration of high density, high speed and high-power electronic devices in small form factor packages and modules. As technologies constantly evolve in areas like Artificial Intelligence (AI), 5G/6G, Electric and Autonomous vehicles, and the Internet of Things (IoT), legacy packaging technologies need to be transitioned to advanced packaging. This shift is also driven by global industry demands, the need for resilient ecosystems, and the adoption of evolving standards. The Global Electronics Association is committed to supporting this transformation by facilitating dialogue between industry, government, and academia.
INDUSTRY IMPORTANCE:
Advancements in compute and storage for automotive applications, sensor technologies with mmWave Radar, LIDAR, and other sensing techniques along with integrated power systems for EV with high voltage, high power components and modules are bringing new challenges to both, Component-Level Packaging (CLP) and Printed Circuit Board Assembly /System-Level-Packaging (SLP). Power delivery, thermal management, assembly and reliability at component/system level demand innovative design approaches, materials and assembly processes for high reliability automotive and industrial requirements.
SYSTEM INTERGATION
Chip-to-package interaction at the component level and package-to-board interaction at the system level are critical for system integration and overall product performance. With heterogeneous integration and miniaturization, components are increasingly moving from the board into the package, enabling 2.5D and 3D System-in-Package (SiP) solutions. Investing in advanced packaging will support industry growth and strengthen Malaysia’s semiconductor ecosystem. This will also foster local SMEs, academic researchers, and innovation hubs, promoting knowledge development and technology transfer. As a result, Malaysia will become more self-reliant and resilient to global supply chain disruptions. These applications require significant system miniaturization through chiplet architectures and heterogeneous integration of processors, memory, power management, sensors, MEMS, and advanced wireless and optical components.
PURPOSE OF THIS WORKSHOP
This workshop is intended to bring together staff from Government bodies, industry experts, academic faculty members from universities to discuss trends, challenges, and possible solutions in component, printed circuit board, and system-level packaging. This workshop is also intended to discuss the needs for developing guidelines/ standards desired for design, assembly, test, reliability and manufacturing.
09:00 AM : Registration & Networking Tea/Coffee 10:00 AM : Introduction to Global Electronics Association by Dr. Ranee Ramya, Country Manager, 10:15 AM : Session on Drivers, Collaboration opportunities, Market Needs & Advanced Electronic Packaging Challenges 03:30 PM : Closing Remarks |
Who can participate?
This session is ideal for Professionals from Semiconductor & Electronics value chain.
Note: Global Electronics Association Member can nominate 3 candidates. Global Electronics Association Non-members can nominate 2 candidates. For any enquiry on membership status please connect with Ranee Ramya, Malaysia Country Manager at RaneeRamya@electronics.org
Free Registration: Click here
Have Any Query? Please Share with us
Dr. Ranee Ramya
Country Manager
Global Electronics Association - Malaysia & Singapore