Venue
Hotel Olive Tree, Penang, Malaysia
Program Schedule
| 09:00 AM Registration & Networking Tea/Coffee 10:00 AM Inauguration session 11:30 AM Technical Session on Drivers, Collaboration opportunities, Market Needs & Advanced Electronic Packaging Challenges 12:30 AM Q& A session 01:00 PM Networking Lunch 02:00 PM Session on Advanced Electronics Packaging, Design, Concepts, Materials, Assembly, Manufacturing 05:00 PM Q&A session 05:30 PM Networking Tea |
Advanced electronic packaging is a vital technology that enables the integration of high density, high speed and high-power electronic devices in small form factor packages and modules. As technologies constantly evolve in areas like Artificial Intelligence (AI), 5G/6G, Electric and Autonomous vehicles, and the Internet of Things (IoT), legacy packaging technologies need to be transitioned to advanced packaging. This shift is also driven by global industry demands, the need for resilient ecosystems, and the adoption of evolving standards. The Global Electronics Association is committed to supporting this transformation by facilitating dialogue between industry, government, and academia.
Advancements in compute and storage for automotive applications, sensor technologies with mmWave Radar, LIDAR, and other sensing techniques along with integrated power systems for EV with high voltage, high power components and modules are bringing new challenges to both, Component-Level Packaging (CLP) and Printed Circuit Board Assembly /System-Level-Packaging (SLP). Power delivery, thermal management, assembly and reliability at component/system level demand innovative design approaches, materials and assembly processes for high reliability automotive and industrial requirements.
Chip to package interaction at the component level packaging and package to board interaction at the system level packaging are indispensable from system level integration and from final product/system performance points of view. With heterogenous integration and miniaturization, some of the components from the board are moving inside the package creating 2.5D and 3D System-in-Package (SiP) solutions.
Investing in advanced packaging will support the growth in an industry. A stronger semiconductor ecosystem will encourage the growth of local small and medium-sized enterprises (SMEs), researchers and faculty members in universities, and research centres, promoting innovation and new knowledge development and transfer. This will make Malaysia more self-reliant and resilient against global supply chain disruptions. These applications demand significant system miniaturization through complex chiplet concepts and heterogenous integration solutions for processors, memories, power management devices along with sensors and MEMS, wireless and optical connectivity and other advanced communication components and systems.
This workshop is intended to bring together staff from Government bodies, industry experts, academic faculty members from universities presenting and discussing components, printed circuit board and system level packaging trends, challenges , possible paths to solutions. This workshop is also intended to discuss the needs for developing guidelines/ standards desired for design, assembly , test, reliability and manufacturing.
Free Registration: Click here
Malaysia Sponsorship: Click here
For more information, please connect with:
Dr. Ranee Ramya
Country Manager - Malaysia
raneeramya@electronics.org