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IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of

What's New in IPC Government Relations

IPC President and CEO John Mitchell and IPC Vice President of Global Government Relations Chris Mitchell talk to PCB Chat host and Circuits Assembly and Printed Circuit Design

Successful Outreach Program in the EU Paves the Way for IMPACT Europe 2018

IPC’s advocacy efforts in Europe have grown significantly over the past few years.

What Will You Discover at IPC APEX EXPO 2018?

John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018. https://www.youtube.com/watch?v=r-xcKwdz9iU&feature=youtu.be

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication

IPC E-Textiles Standards Committee Seeks Comments on Draft of New E-Textiles Standard; Participants Needed to Join Subcommittee to Develop E-Textiles Connectors Guideline

Learn about the IPC E-Textiles standards committee seeking new comments on a draft of new e-textiles standard.