Global Electronics Association Knowledge Hub

This session, held on November 15, 2022, introduced the major updates in IPC/WHMA-A-620 Revision D. Attendees reviewed key changes, clarified acceptance criteria, and explored how the revisi .. read more

On November 2, 2022, this webinar covered essential best practices for wire harness manufacturing, offering practical insights to improve quality, efficiency, and reliability. Topics include .. read more

With AI rapidly transforming smart manufacturing, the May 14, 2025 webinar examined how electronics manufacturers can effectively integrate Computer Vision AI and Generative AI to boost qual .. read more

This February 12, 2025 webinar, led by John Watson, explored the growing role of artificial intelligence in revolutionizing PCB design. The session demonstrated how AI is improving speed, pr .. read more

On January 22, 2025, this webinar introduced key PCB design principles—Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). Attendees learned how applying th .. read more

This December 11, 2024 webinar showcased cutting-edge approaches for inspecting electronic assemblies using 3D X-ray microscopy, nanoscale imaging, and deep learning. Attendees learned how t .. read more

As cybersecurity threats continue to grow across global supply chains, the November 13, 2024, webinar offered a timely introduction to IPC-1792, the new standard addressing cybersecurity in .. read more

On October 31, 2024, this webinar explored the vital role of frontline response and preparedness in managing cyber threats within electronics manufacturing. Attendees learned how early detec .. read more

In this informative session held on September 18, 2024, participants explored the latest revisions to IPC-6012 and IPC-A-600—essential standards for the qualification and acceptance of rigid .. read more

On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D .. read more

In advance of his August IPC Counterfeit Electronic Parts Mitigation course, Anthony J. Bryant hosted a focused webinar on July 31, 2024, examining the critical issue of counterfeit document .. read more

On June 19, 2024, this webinar offered a comprehensive look into the PCB board fabrication process, following the journey of design artwork after it reaches the board shop. Tailored for Elec .. read more

On May 1, 2024, a panel of industry experts discussed the root causes of creep corrosion in electronics, along with relevant testing methods and effective mitigation strategies. The session .. read more

On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract .. read more

On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he .. read more

On January 10, 2024, this webinar covered best practices for minimizing and managing flux residues in electronics manufacturing. It addressed risks associated with low standoff components, m .. read more

On December 6, 2023, this webinar provided non-professional cybersecurity specialists with essential information and awareness to better understand today’s cybersecurity landscape—no extensi .. read more

On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices. .. read more

Held on October 31, 2023, this webinar featured Dr. Bev Christian presenting "Delivering Engaging Technical Presentations." The session offered practical strategies for improving the clarity .. read more

On September 28, 2023, Stanton Rak, Ph.D., presented a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." In this session, Dr. Rak shared expert gu .. read more

On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ .. read more

This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs an .. read more

This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610 .. read more

Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero .. read more

The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context o .. read more

This webinar, held on March 15, 2023, covered a brief introduction to the types of machine data available in an EMS factory and how to set up an analytics environment using freely available, .. read more

On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect .. read more

This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad, .. read more

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a .. read more

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou .. read more

Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec .. read more

IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est .. read more

As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r .. read more

HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex .. read more

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. read more

In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille .. read more

Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti .. read more

The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu .. read more

Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being .. read more

The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog .. read more

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. read more

To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real .. read more

Recently, there has been an increase in production stoppages due to cyber-attacks on suppliers. Criminals attack the weakest point of your supply chain. However, little progress has been mad .. read more

IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application .. read more

Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab .. read more

As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee .. read more

In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space .. read more

This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit .. read more

Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem .. read more

Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d .. read more