Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Monitoring the Pulse of the Global Electronics Industry July 2025
Persistent Cost Pressures Offset by Solid Demand Conditions: The globalelectronics manufacturing supply chain remains under pressure from rising input costs,with 61% of firms reporti
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How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the i
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Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board
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Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies
It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in
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Reliability Validation of Direct-Write Printed RF Devices
Additive manufacturing (AM) methods to fabricate and repair printed hybrid electronic (PHE) components and interconnect systems create compelling opportunities in 3D curvilinear architecture
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The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing,
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Liquid Metal Patterning for Electronic Circuits and Thermal Management
Gallium-based liquid metals have remarkable properties: melting points below room temperature, wide conductivity, water-like viscosity, low toxicity, and effectively zero vapor pressure (the
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Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - a Revealing Round Robin Study
Voiding and solder coverage in SMT solder joints remain a matter of (sometimes emotional) debate in automotive electronics. Meanwhile voiding/solder coverage requirements have been introduce
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Research on High-speed Material Insertion Loss in Server Platform
At present, with the rapid change of the server market, Eagle Stream platform chipset, which changes the traditional practice of Whiley platform material selection and stack mode compared wi
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Achieving a Successful ENEPIG Finished PCB under Revision A of IPC-4556
The 4-14F IPC Standards Committee are close to finalizing (at the time of writing) a revision to the IPC 4556 specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPI
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Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications
Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One solution for board-level thermal management i
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New Solutions for Inclusion-free Copper Filling Of Through Vias for Latest Generation Substrate Designs
In advanced printed circuit board and IC substrate production, the metallization for blind vias and through vias (also called through holes – TH) is essential for the build-up of the PCB or
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Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
In HDI (high density interconnect) PCB (printed circuit board) and IC Substrate (integrated circuit substrate), a successfully formed and plated laser via is crucial to the overall system an
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Maximize Throughput with Innovative Laser/Optics Configuration, Precision Pulse Shaping, and Steering Designed for ABF Materials
Flip chip ball grid array (FCBGA) package substrate components provide the critical building blocks for electronic devices and high-performance computers. They will enable the future of supe
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Strategies for Enhanced Reliability in the Cleaning of Vented Components
The need for cleaning circuit card assemblies is well understood for achieving optimum reliability; contamination present on assemblies can lead to detrimental effects, including dendritic g
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On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Direct Digital Manufacturing (DDM) is a growing field in which Additively Manufactured Electronics (AMEs) are manufactured on a single machine through a variety of additive and subtractive t
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Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
Thorough cleaning processes are necessary due to their critical role in ensuring optimal system performance. Residual contaminants can significantly compromise printed circuit card assemblie
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Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
Additive Manufacturing (AM) offers numerous benefits over traditional manufacturing methods, such as realization of unique form factors, decreased waste in material, decreased cost and lead
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Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
At millimeter-wave frequencies, considerations of electrical performance and PCB durability may often lead to contradictory requirements with respect to copper foil materials and chemical pr
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Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
As the electronics industry continually strives for innovation and efficiency in assembly and rework processes, the exploration of low temperature (LT) solder alloys has gained significant a
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Development and Enhancement of Low Temperature Soldering Solution for SMT
The global interest in reducing CO2, as demonstrated by carbon neutrality, is growing in order to achieve a low-carbon society. Electronic packaging industry is seeing the importance of SnBi
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Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies
Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, miniaturized, and complex electronic assemblies. This techniq
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Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness is of central importance to find the optimal layout for demanding applications. Especially in industry sec
Continuous pursuits for higher data rate, larger network capacity, lower latency communication, and better energy efficiency have motivated the rapid development of high-frequency communicat
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Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness is of central importance to find the opti
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Research On Influence Factors Of Expansion And Shrinkage Compensation For Multilayer PCB
The multilayer PCB is prone to poor expansion and shrinkage due to the influence of high temperature and high pressure during lamination process, which may cause risk of abnormal quality. Th
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