Welcome to Industry Intelligence Insights, your monthly guide to the trends and data shaping the global electronics manufacturing landscape.

President Donald Trump last week unveiled the National AI Action Plan and signed a trio of executive orders aimed at advancing U.S. leadership in the Global AI race.

Measuring training programs' return on investment (ROI) is essential for justifying workforce development efforts, but it comes with challenges. From quantifying intangible

IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for

IPC successfully convened its 2025 Q2 Executive Policy Roundtable on May 21 at Tokyo Kaikan. The event brought together senior government officials, corporate executives, and

The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is conducting its annual study on behalf of the Department of Defense to

Last week, I had the opportunity to attend Circularity 25 in Denver—an inspiring gathering of professionals working to advance circular solutions across industries. With

On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry

One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and