Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. leer más
JPCA Standards of Optoelectronic Assembly Technology
JPCA has been developing standards necessary for adoption of optoelectronic technology especially for consumer
applications for years. The subjects being drafted are the technology that is fair
.. leer más
Imprinted Interconnects Technology (I2T),a Revolutionary Method for the Production of Very-High-Density Interconnects (VHDI)
Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more
importantly,to decrease manufacturing costs. The current technological approach d
.. leer más
Micro Via Drilling Technology
Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are
developing the higher density PWB for the future application.
The emerging 300
.. leer más
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. leer más
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. leer más
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the
total void content is minimal. X-ray methods are the predominate method for so
.. leer más
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. leer más
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. leer más
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. leer más
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. leer más
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. leer más
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. leer más
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. leer más
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. leer más
Novel,VOC-Compliant Aqueous Cleaning Agents for Post-Solder Defluxing
To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit
outstanding cleaning performance for a variety of flux residues. The new cleanin
.. leer más
Innovations using Ethyl Nonafluorobutyl Ether Provide Superior Solvent Properties for Defluxing No-Clean and Microelectronic Assemblies
The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE-
7200) provides the fluid dynamics to build engineered cleaning fluids that exhi
.. leer más
Can One Effectively Clean Under Low Stand off Components (<4 MIL or 0.004 Inches)?
With the ban of CFC’s,various cleaning processes have emerged and have been established as viable
alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in-
.. leer más
OEM/EMS NPI Collaboration: Optimizing the Design and NPI Supply Chain to Improve Time-To-Volume Manufacturing
The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core
competencies that enhance shareholder value. This outsourcing trend i
.. leer más
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. leer más
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. leer más
Integrated Forecasting Across Value Chain
The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The
current business environment of a multi-company value chain,alliances and partnersh
.. leer más
Automated Design Verification using DFM/DFT
In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a
customer’s product goes to production is paramount. Design deficiencies or devia
.. leer más
AOI in EMS
As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to
the diversity of the business,EMS providers require equipment that can handle a myri
.. leer más
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. leer más
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. leer más
A Cost Effective Solution for Supporting Populated Circuit Boards during the Solder Paste Print Operation
Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time
consuming to setup,and relatively expensive. This is because support pins or dedica
.. leer más
Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation
The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products
mandate the enhancement of manufacturing systems and assembly yields. In fine pit
.. leer más
Efficient Placement Performance Verification of Odd Form Assembly Equipment
One of the electronic assembly markets that has
been emerging in recent years is the automation
equipment associated with odd form component
placement and final product assembly. As with
insert
.. leer más
Oven Characterization Using Machine Quality Management (MQM) Tools
Stability and repeatability are imperative in any
reflow oven today. If oven operation is not validated
periodically,all subsequent profiles and adjustments
are not reliable in finding or maint
.. leer más
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. leer más
JPCA Standards of Optoelectronic Assembly Technology
JPCA has been developing standards necessary for adoption of optoelectronic technology especially for consumer
applications for years. The subjects being drafted are the technology that is fair
.. leer más
Imprinted Interconnects Technology (I2T),a Revolutionary Method for the Production of Very-High-Density Interconnects (VHDI)
Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more
importantly,to decrease manufacturing costs. The current technological approach d
.. leer más
Micro Via Drilling Technology
Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are
developing the higher density PWB for the future application.
The emerging 300
.. leer más
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. leer más
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. leer más
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the
total void content is minimal. X-ray methods are the predominate method for so
.. leer más
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. leer más
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. leer más
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. leer más
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. leer más
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. leer más
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. leer más
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. leer más
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. leer más
Novel,VOC-Compliant Aqueous Cleaning Agents for Post-Solder Defluxing
To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit
outstanding cleaning performance for a variety of flux residues. The new cleanin
.. leer más
Innovations using Ethyl Nonafluorobutyl Ether Provide Superior Solvent Properties for Defluxing No-Clean and Microelectronic Assemblies
The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE-
7200) provides the fluid dynamics to build engineered cleaning fluids that exhi
.. leer más
Can One Effectively Clean Under Low Stand off Components (<4 MIL or 0.004 Inches)?
With the ban of CFC’s,various cleaning processes have emerged and have been established as viable
alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in-
.. leer más
OEM/EMS NPI Collaboration: Optimizing the Design and NPI Supply Chain to Improve Time-To-Volume Manufacturing
The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core
competencies that enhance shareholder value. This outsourcing trend i
.. leer más
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. leer más
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. leer más
Integrated Forecasting Across Value Chain
The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The
current business environment of a multi-company value chain,alliances and partnersh
.. leer más
Automated Design Verification using DFM/DFT
In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a
customer’s product goes to production is paramount. Design deficiencies or devia
.. leer más
AOI in EMS
As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to
the diversity of the business,EMS providers require equipment that can handle a myri
.. leer más
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. leer más
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. leer más
A Cost Effective Solution for Supporting Populated Circuit Boards during the Solder Paste Print Operation
Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time
consuming to setup,and relatively expensive. This is because support pins or dedica
.. leer más
Yield Prediction for Area Array Assemblies Using Monte Carlo Simulation
The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products
mandate the enhancement of manufacturing systems and assembly yields. In fine pit
.. leer más
Efficient Placement Performance Verification of Odd Form Assembly Equipment
One of the electronic assembly markets that has
been emerging in recent years is the automation
equipment associated with odd form component
placement and final product assembly. As with
insert
.. leer más
Oven Characterization Using Machine Quality Management (MQM) Tools
Stability and repeatability are imperative in any
reflow oven today. If oven operation is not validated
periodically,all subsequent profiles and adjustments
are not reliable in finding or maint
.. leer más