Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association today announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.
As advanced electronic packaging becomes increasingly important to next-generation semiconductor and system innovation, the industry is shifting from isolated technology development toward closer collaboration across the supply chain. This shift reflects the growing role of advanced packaging in system-level integration, where progress increasingly depends on expertise spanning multiple parts of the electronics value chain. Taiwan remains a key center of innovation in this area, making technical engagement and industry collaboration increasingly important to the future development of advanced electronic packaging technologies.
In this role, Lee will support Technology Solutions in Taiwan by fostering technical collaboration across the electronics ecosystem, contributing to standards/guidelines development and technology roadmapping efforts, and engaging with industry, academia, and research organizations to address emerging challenges in advanced electronic packaging.
“Taiwan plays a pivotal role in the global electronics supply chain and continues to lead innovation in advanced electronic packaging technologies,” said Matt Kelly, CTO & VP Technology Solutions of the Global Electronics Association. “As advanced packaging becomes an increasingly important driver of semiconductor and system innovation, competitive advantage will depend not only on technology leadership, but also on how effectively expertise is shared across the broader ecosystem. Taiwan’s depth of knowledge and strong industry participation position it to help shape the next generation of packaging technologies. Jeffrey’s extensive technical expertise, industry leadership, and long-standing involvement in global standards development will help strengthen connections with Taiwan’s technical community and support Technology Solutions in the region.”
Lee brings more than 30 years of experience in semiconductor packaging, PCB assembly, materials engineering, quality and reliability, and technology development. He has been an active contributor to many international industry organizations, including IPC, JEDEC, SEMI, SMTA, IMAPS, IEEE Electronics Packaging Society (EPS), TPCA, and iNEMI.
This appointment reflects the Global Electronics Association’s continued commitment to strengthening engagement with Taiwan’s advanced electronic packaging community. By expanding its technical presence in the region, the Association aims to strengthen connections between Taiwan’s expertise and its global technology initiatives, helping ensure that insights from one of the world’s leading advanced packaging ecosystems contribute to the future development of the global electronics industry.