Venue
Setia SPICE Convention Centre, Penang, Function Room 1
Program Schedule
10:00 AM | Registration & Networking |
10:30 AM | Welcome Address & Introduction by Dr. Ranee Ramya , Country Manager, IPC Malaysia |
11:00 AM | Presentation on PCB Design for Signal Integrity by Master IPC Trainer |
12:30 AM | Q & A Session |
PCB Design for Signal Integrity
In the highly competitive electronics industry, the knowledge and skills of designers are directly responsible for the design and layout of the Printed Circuit Board (PCB) and Printed Board Assembly (PBA), which can have a direct impact on the success or failure of the product design and affect time to market. Signal integrity is a critical aspect of modern PCB design, especially in high-speed digital applications, where the design and layout of the PCB and PBA can significantly influence the product’s performance and reliability. It is essential to ensure high-speed signals travel without distortion, delay, or loss. Poor signal integrity can lead to costly rework, system failures, and delays in time to market.
Who can participate?
This session is ideal for electronics manufacturing professionals—process engineers, quality assurance specialists, and technicians from Semiconductor, E&E, and OSAT sectors
Note : IPC Member can nominate 3-4 candidates. IPC Non-member can nominate 2 candidates. For any enquiry on membership status please connect with Ranee Ramya, Malaysia Country Manager raneeramya@ipc.org
Registration : Free
Link for Registration