IPC Builds-Standards Development Committee Meetings

Date
-

We're Building Better Electronics for a Better World

Join us for IPC Builds in September 2026

The Global Electronics Association, is pleased to announce that IPC Builds 2026 is now open for registration.

IPC Builds 2026 is a week-long series of standards development meetings to be held in Europe. 

Over the years, volunteers worldwide have participated in IPC standards development committee meetings to bring the most trusted standards for electronics manufacturing to the industry. In 2026, we’re excited to head to Paris for this traditional and industry-driving event.

Why Attend?

Committee Meetings

Make your voice heard and help ensure IPC standards reflect the real needs of the industry.

Your participation in standards development committee meetings is essential - your expertise helps drive the quality, reliability, and consistency that IPC standards are known for.

IPC Builds is centered on IPC Standards, giving you the opportunity to directly contribute to the guidelines your company, customers, suppliers, and even competitors rely on every day. Newcomers, industry veterans, trainers, and all individuals in the electronics industry are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including: 

  • Materials
  • Design
  • PCB fabrication
  • PCB assembly
  • Factory of the Future
  • E-Textiles
  • 3D Plastronics 
  • Training 
  • other

Agenda

Registration Hours
Saturday, 19 September - Thursday, 24 September | 7:00 am-17:00 pm

Lunch Included each day 

Committee Meetings
Saturday, 19 September - Sunday, 20 September | All Day
Monday, 21 September - Wednesday, 23 September | All Day
Thursday, 24 September | Morning Only

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting 

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting

7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting

All Day 

Product Assurance
7-31F IPC/WHMA-A-620 Task Group

Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee

 
Morning

Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee

Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee

Printed Board Design Technology
1-10D Material Selection for Design Task Group

Terms and Definitions
2-30 Terms and Definitions Committee

 
Afternoon

Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group

Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group 

Process Control
7-25 AOI Subcommittee

Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group

Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group

Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group

Morning

Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group

Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group

Base Materials
3-12A Metallic Foil Task Group

Cleaning and Coating
5-32G Residue Assessment Task Group

Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group

 

Afternoon

Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee  

Printed Electronics 
D-67 Additively Manufactured Electronics Subcommittee

Assembly and Joining 
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group

Cleaning and Coating
5-31D Cleaning Handbook Task group 

Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19 Supply Chain Traceability and Trust Subcommittee 

Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan

High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee

Testing
7-12 Microsection Subcommittee

Morning

Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group

Printed Electronics
D-60 Printed Electronics Committee

Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group

Cleaning and Coating
5-33A Conformal Coating Task Group

Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group

Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee

 

Afternoon

Assembly and Joining 
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group

Base Materials
3-11J Metal Based Laminates for Printed Boards

Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group

Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee

High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee

3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group

Morning 

Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting 

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting

7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting

All Day 

Product Assurance
7-31F IPC/WHMA-A-620 Task Group

Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee

 
Morning

Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee

Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee

Printed Board Design Technology
1-10D Material Selection for Design Task Group

Terms and Definitions
2-30 Terms and Definitions Committee

 
Afternoon

Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group

Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group 

Process Control
7-25 AOI Subcommittee

Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group

Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group

Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group

Morning

Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group

Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group

Base Materials
3-12A Metallic Foil Task Group

Cleaning and Coating
5-32G Residue Assessment Task Group

Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group

 

Afternoon

Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee  

Printed Electronics 
D-67 Additively Manufactured Electronics Subcommittee

Assembly and Joining 
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group

Cleaning and Coating
5-31D Cleaning Handbook Task group 

Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19 Supply Chain Traceability and Trust Subcommittee 

Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan

High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee

Testing
7-12 Microsection Subcommittee

Morning

Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group

Printed Electronics
D-60 Printed Electronics Committee

Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group

Cleaning and Coating
5-33A Conformal Coating Task Group

Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group

Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee

 

Afternoon

Assembly and Joining 
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group

Base Materials
3-11J Metal Based Laminates for Printed Boards

Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group

Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee

High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee

3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group

Morning 

Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group

Registration

Who Should Attend?

This event is meant for all professionals with an interest in IPC standards development committee meetings, from newcomers to longtime industry committee participants and leaders. Your registration also includes networking opportunities and lunches. 

Registrations options

Registration is subject to a registration fee for Global Electronics Association members as well as for non-members.

Registration is valid for the entire event period. Participants are required to register whether they plan to attend all six days or only part of the event. The registration fee contributes to the overall organization costs and includes lunches for the full duration of the event.

Register now to secure your spot at IPC Builds 2026 and be part of industry change!

                                                   REGISTER NOW

Advance Registration

Process: Advanced registration is mandatory for all attendees. 

The registration fee will be 250 EUR for the Association Members and 350 EUR for non-Members.  

  • Member price : 250 EUR
  • Non-Member price : 350 EUR

The registration process will always prompt you to register and pay by credit card (Visa, Mastercard, or Amex) as a non-Member = 350 EUR. 

This will allow the Global Electronics Association to confirm your membership status before issuing any invoice.

As soon as your registration is processed, Global Electronics Association Customer Service will double-check whether your Company is a valid Association member. In case it is, then you will receive a 100 EUR refund directly to the credit card you have used for registration, before the final invoice is issued.

On-site Registration

On-site registration will be available for last-minute participants (payment by credit card only: Visa, Mastercard, or Amex). 

Given the timeline, it will not be possible to differentiate on-site Members and Non-Members, and additional processing costs will apply. Invoices for on-site registrations will be sent to participants after the event.

The on-site registration price is set at 400 EUR (whatever the membership status is at that time).

  • On-site Last-Minute price : 400 EUR

Event Venue & Dates

Hosted at the H4 Hotel Wyndham Paris Pleyel Resort in Saint-Denis, France.

A modern venue offering dedicated conference facilities and networking spaces as well as large hotel room capacity.

Address: 

H4 Hotel Wyndham Paris Pleyel Resort, 

149 Boulevard Anatole-France, 

93200 Saint-Denis,

France 

Dates: 19-24 September 2026

H4 Hotel Wyndham Paris Pleyel Resort Website

Hotel Wyndam Paris

 

Meeting room Paris
Hotel Information

The following room blocks are available for IPC Builds:

  • Hotel H4 Hotel Wyndham Paris Pleyel – Global Electronics Association has contracted a room block for you, and rooms are available - double room, price per night/169 EUR, includes breakfast for 1 person. 

Check-in and check-out dates can be adjusted until 20 August 2026 COB. 

Room block ends on 20 August 2026 and rooms remaining not attributed will be released after this date.

To take advantage of these room blocks, participants will have to book directly using this dedicated hotel hyperlink upon which the hotel will send participants their confirmation number directly. All rooms are payable at the hotel reception at time of check-in. 

Book Your Hotel Accomodation HERE

Important note: Hotel cancellations or modifications are free of charge until 20 August 2026 COB.

We can’t wait to welcome you to Paris, France in September 2026!

Contact

For more information, please contact:

Philippe Léonard, Global Electronics Association Europe Director

📧 PhilippeLeonard@electronics.org

Anatolii Kazmin, Europe Event Manager

📧 anatoliikazmin@electronics.org

Teresa Rowe, Senior Director Industry Standards 

TeresaRowe@electronics.org

Region