IPC Builds-Standards Development Committee Meetings
We're Building Better Electronics for a Better World
Join us for IPC Builds in September 2026
The Global Electronics Association, is pleased to announce that IPC Builds 2026 is now open for registration.
IPC Builds 2026 is a week-long series of standards development meetings to be held in Europe.
Over the years, volunteers worldwide have participated in IPC standards development committee meetings to bring the most trusted standards for electronics manufacturing to the industry. In 2026, we’re excited to head to Paris for this traditional and industry-driving event.
Why Attend?
Committee Meetings
Make your voice heard and help ensure IPC standards reflect the real needs of the industry.
Your participation in standards development committee meetings is essential - your expertise helps drive the quality, reliability, and consistency that IPC standards are known for.
IPC Builds is centered on IPC Standards, giving you the opportunity to directly contribute to the guidelines your company, customers, suppliers, and even competitors rely on every day. Newcomers, industry veterans, trainers, and all individuals in the electronics industry are welcome. Participate and learn more about these critical industry documents.
IPC Standard Development Committees cover a range of topics, including:
- Materials
- Design
- PCB fabrication
- PCB assembly
- Factory of the Future
- E-Textiles
- 3D Plastronics
- Training
- other
Agenda
Registration Hours
Saturday, 19 September - Thursday, 24 September | 7:00 am-17:00 pm
Lunch Included each day
Committee Meetings
Saturday, 19 September - Sunday, 20 September | All Day
Monday, 21 September - Wednesday, 23 September | All Day
Thursday, 24 September | Morning Only
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting
All Day
Product Assurance
7-31F IPC/WHMA-A-620 Task Group
Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee
Morning
Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee
Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee
Printed Board Design Technology
1-10D Material Selection for Design Task Group
Terms and Definitions
2-30 Terms and Definitions Committee
Afternoon
Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group
Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group
Process Control
7-25 AOI Subcommittee
Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group
Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group
Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group
Morning
Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group
Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group
Base Materials
3-12A Metallic Foil Task Group
Cleaning and Coating
5-32G Residue Assessment Task Group
Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group
Afternoon
Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee
Printed Electronics
D-67 Additively Manufactured Electronics Subcommittee
Assembly and Joining
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group
Cleaning and Coating
5-31D Cleaning Handbook Task group
Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19 Supply Chain Traceability and Trust Subcommittee
Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan
High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee
Testing
7-12 Microsection Subcommittee
Morning
Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Printed Electronics
D-60 Printed Electronics Committee
Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group
Cleaning and Coating
5-33A Conformal Coating Task Group
Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group
Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee
Afternoon
Assembly and Joining
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group
Base Materials
3-11J Metal Based Laminates for Printed Boards
Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group
Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee
High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee
3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group
Morning
Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting
All Day
Product Assurance
7-31F IPC/WHMA-A-620 Task Group
Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee
Morning
Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee
Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee
Printed Board Design Technology
1-10D Material Selection for Design Task Group
Terms and Definitions
2-30 Terms and Definitions Committee
Afternoon
Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group
Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group
Process Control
7-25 AOI Subcommittee
Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group
Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group
Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group
Morning
Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group
Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group
Base Materials
3-12A Metallic Foil Task Group
Cleaning and Coating
5-32G Residue Assessment Task Group
Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group
Afternoon
Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee
Printed Electronics
D-67 Additively Manufactured Electronics Subcommittee
Assembly and Joining
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group
Cleaning and Coating
5-31D Cleaning Handbook Task group
Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19 Supply Chain Traceability and Trust Subcommittee
Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan
High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee
Testing
7-12 Microsection Subcommittee
Morning
Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Printed Electronics
D-60 Printed Electronics Committee
Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group
Cleaning and Coating
5-33A Conformal Coating Task Group
Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group
Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee
Afternoon
Assembly and Joining
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group
Base Materials
3-11J Metal Based Laminates for Printed Boards
Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group
Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee
High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee
3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group
Morning
Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Registration
Who Should Attend?
This event is meant for all professionals with an interest in IPC standards development committee meetings, from newcomers to longtime industry committee participants and leaders. Your registration also includes networking opportunities and lunches.
Registrations options
Registration is subject to a registration fee for Global Electronics Association members as well as for non-members.
Registration is valid for the entire event period. Participants are required to register whether they plan to attend all six days or only part of the event. The registration fee contributes to the overall organization costs and includes lunches for the full duration of the event.
Register now to secure your spot at IPC Builds 2026 and be part of industry change!
Advance Registration
Process: Advanced registration is mandatory for all attendees.
The registration fee will be 250 EUR for the Association Members and 350 EUR for non-Members.
- Member price : 250 EUR
- Non-Member price : 350 EUR
The registration process will always prompt you to register and pay by credit card (Visa, Mastercard, or Amex) as a non-Member = 350 EUR.
This will allow the Global Electronics Association to confirm your membership status before issuing any invoice.
As soon as your registration is processed, Global Electronics Association Customer Service will double-check whether your Company is a valid Association member. In case it is, then you will receive a 100 EUR refund directly to the credit card you have used for registration, before the final invoice is issued.
On-site Registration
On-site registration will be available for last-minute participants (payment by credit card only: Visa, Mastercard, or Amex).
Given the timeline, it will not be possible to differentiate on-site Members and Non-Members, and additional processing costs will apply. Invoices for on-site registrations will be sent to participants after the event.
The on-site registration price is set at 400 EUR (whatever the membership status is at that time).
- On-site Last-Minute price : 400 EUR
Event Venue & Dates
Hosted at the H4 Hotel Wyndham Paris Pleyel Resort in Saint-Denis, France.
A modern venue offering dedicated conference facilities and networking spaces as well as large hotel room capacity.
Address:
H4 Hotel Wyndham Paris Pleyel Resort,
149 Boulevard Anatole-France,
93200 Saint-Denis,
France
Dates: 19-24 September 2026
H4 Hotel Wyndham Paris Pleyel Resort Website
Hotel Information
The following room blocks are available for IPC Builds:
- Hotel H4 Hotel Wyndham Paris Pleyel – Global Electronics Association has contracted a room block for you, and rooms are available - double room, price per night/169 EUR, includes breakfast for 1 person.
Check-in and check-out dates can be adjusted until 20 August 2026 COB.
Room block ends on 20 August 2026 and rooms remaining not attributed will be released after this date.
To take advantage of these room blocks, participants will have to book directly using this dedicated hotel hyperlink upon which the hotel will send participants their confirmation number directly. All rooms are payable at the hotel reception at time of check-in.
Book Your Hotel Accomodation HERE
Important note: Hotel cancellations or modifications are free of charge until 20 August 2026 COB.
We can’t wait to welcome you to Paris, France in September 2026!
Contact
For more information, please contact:
Philippe Léonard, Global Electronics Association Europe Director
📧 PhilippeLeonard@electronics.org
Anatolii Kazmin, Europe Event Manager
📧 anatoliikazmin@electronics.org
Teresa Rowe, Senior Director Industry Standards