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Printed electronics and additively manufactured electronics represent a fast-growing frontier in electronic design and production, enabling new levels of flexibility, functionality and innovation. The Global Electronics Association’s library of IPC standards for this area of industry provides the global framework needed to design, qualify and manufacture these technologies. Covering everything from base materials and conductive/dielectric inks to design guidelines, performance specifications and test methodologies, these standards ensure consistency, reliability and interoperability throughout the supply chain. Together, they help companies accelerate product development, reduce risk and confidently bring these next-generation electronics to market.
IPC-2292 stablishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertaining to this standard, are materials, devices or functionalized circuitry which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable.
This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products. The intent of IPC/JPCA-2291 is to establish a design process flow that will facilitate and improve the practice of printed electronics design. IPC/JPCA-2291 identifies documents such as standards that can be used to assist during the design process flow.
IPC-2294 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.
This standard provides and defines key characteristics and test methods for procuring printed electronics substrates. Includes six materials specification sheets.
The IPC-4591A standard establishes the classification system and the qualification and quality conformance requirements for functional conductive materials used in printed electronics applications. It provides companies that procure functional materials for printed electronics with the necessary technical structure to design and manufacture products meeting conformance to industry-determined metrics.
The IPC-4592 standard establishes the classification system, the qualification and quality conformance requirements for functional dielectric materials used in printed electronics applications. The intended applications include but are not limited to dielectric materials as protective dielectric or insulator/insulation layer(s), capacitive layer(s), crossovers and encapsulant(s) for devices in printed electronics systems.
This standard establishes a Market Classification System and Level Classification System for printed electronics assemblies and provides a list of performance criteria and testing methods. It provides a standardized product category structure for designing and manufacturing printed electronics and assemblies which conform to industry-established performance metrics as determined by accepted testing methods.
The IPC-6902 standard establishes and defines the qualification and performance requirements for printed electronics and the forms of component mounting and interconnecting structures on flexible substrates.
IPC-T-51 standard provides terms and definitions for the design and manufacture of printed electronics. IPC-T-51 standard enables common language and understanding for the worldwide printed electronics community.
IPC-6904 standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates. The substrate can be conductive, semiconductive or nonconductive.
This guideline describes flexibility and stretchability testing to evaluate printable electronics for stretchable and wearable applications.
The IPC-9257 standard assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Electrical testing of flexible printed electronics ensures conformance to electrical design requirements specified in IPC-6902. The IPC-9257 standard defines different levels of testing available to achieve this purpose.
This standard will describe the acceptable and nonconforming conditions that are either externally or internally observable on additively manufactured electronics. It will represent the visual interpretation of minimum requirements set forth in the new qualification and reliability standard being developed concurrently with this standard.
IPC-6911 Coming Soon!
This standard will establish and define the qualification and performance requirements for additively manufactured electronics and their forms of component mounting and interconnecting structures.
Additively manufactured electronics, as pertains to this standard, are fully functionalized circuits that are manufactured using additive manufacturing techniques.
IPC-6905 Coming Soon!