IPC Builds-Standards Development Committee Meetings
The standards powering global electronics start here.
IPC Builds brings together the global electronics community for one week of standards development that shapes how the entire industry designs, builds, and tests, laying the groundwork for the next generation of electronics standards. September 19–24 in Paris. Register now.
WHAT IS IPC BUILDS?
Every standard your company works to, from IPC-A-610, J-STD-001, IPC-6012, IPC-A-600 to IPC/WHMA-A-620 and dozens more, are written, refined, and approved by working groups of industry professionals from across the global supply chain who show up, raise their hands, and make their expertise count.
That's IPC Builds. It's a week-long series of standards development meetings where the global electronics community comes together to do the actual work: updating existing standards to meet current trends, resolving emerging technical challenges, forecasting where the industry is heading, and building the next-generation frameworks that will define quality and reliability for the global supply chain.
The standards that will govern tomorrow's technologies are being developed right now, by people who show up. This year, they will be at IPC Builds in Paris, France, September 19–24, 2026.
WHY YOUR PRESENCE MATTERS
IPC standards don't write themselves. They reflect the real-world knowledge, hard-won expertise, and practical foresight from you and other professionals who shape them.
When you attend IPC Builds, your voice shapes the language of the standard. Your expertise influences the criteria. Your participation helps the industry anticipate what's coming and not just react to what's already here.
Whether you're attending your first committee meeting or you've been a task group chair for years, IPC Builds is where your contribution goes directly into the documents the entire industry trusts.
WHAT'S ON THE AGENDA
More than 60 meetings are scheduled across six days, covering the full range of electronics manufacturing disciplines, from established standards revisions to forward-looking work on emerging technologies:
- Product Assurance — Printed boards, assemblies and wire harness
- Assembly & Joining — Solderability, solder alloys, bottom termination components, SiP
- Base Materials — Laminates, metallic foils, metal-based substrates
- Rigid & Flexible Printed Boards — Design, fabrication, reliability
- Cleaning & Coating — Conformal coating, flux residues, CAF, potting and encapsulation
- Printed Electronics — 3D plastronics, additively manufactured electronics
- Electronic Data & Traceability — Design data transfer, Connected Factory Exchange, Hermes, materials and process traceability, supplier declaration data flows, CO₂e reporting
- High Speed / High Frequency — RF/microwave performance, high-speed base materials
- Process Control & Reliability — SMT attachment reliability, inspection, microsection analysis
AGENDA
Registration Hours
Saturday, 19 September - Thursday, 24 September | 7:00 am-17:00 pm
Lunch Included each day
Committee Meetings
Saturday, 19 September - Sunday, 20 September | All Day
Monday, 21 September - Wednesday, 23 September | All Day
Thursday, 24 September | All Day
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting
All Day
Product Assurance
7-31F IPC/WHMA-A-620 Task Group
Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee
Morning
Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications
Base Materials
3-11A Base Materials Committee
Cleaning and Coating
5-32E Conductive Anodic Filament (CAF) Task Group
5-33B Solder Mask Performance Task Group
Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee
Printed Board Design Technology
1-10D Material Selection for Design Task Group
Terms and Definitions
2-30 Terms and Definitions Committee
Afternoon
Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group
Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group
Process Control
7-25 Automated Inspection Process Control Task Groups
Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group
Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group
Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group
Morning
Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group
Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group
Base Materials
3-12A Metallic Foil Task Group
Cleaning and Coating
5-32G Residue Assessment Task Group
Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group
Rigid Printed Board
D-31B IPC-2221 Task Group
D-33AA IPC-6012 Automotive Addendum Task Group
Afternoon
Product Assurance
7-31N Manual Magnification Aides Task group
7-31R IPC-HDBK-630 Task Group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee
Printed Electronics
D-67 Additively Manufactured Electronics Subcommittee
Assembly and Joining
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group
Cleaning and Coating
5-31D Cleaning Handbook Task group
Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19F Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions Task Group
Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan
High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee
Testing
7-12 Microsection Subcommittee
Morning
Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Printed Electronics
D-60 Printed Electronics Committee
Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group
Cleaning and Coating
5-33A Conformal Coating Task Group
Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group
Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee
Afternoon
Assembly and Joining
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group
Base Materials
3-11J Metal Based Laminates for Printed Boards
Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group
Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee
High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee
3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group
Morning
Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Afternoon
Rigid Printed Boards
D-31E Depaneling Technology Task Group
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
All Day
Product Assurance
5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting
7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting
All Day
Product Assurance
7-31F IPC/WHMA-A-620 Task Group
Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee
Morning
Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications
Base Materials
3-11A Base Materials Committee
Cleaning and Coating
5-32E Conductive Anodic Filament (CAF) Task Group
5-33B Solder Mask Performance Task Group
Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee
Printed Board Design Technology
1-10D Material Selection for Design Task Group
Terms and Definitions
2-30 Terms and Definitions Committee
Afternoon
Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group
Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group
Process Control
7-25 Automated Inspection Process Control Task Groups
Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group
Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group
Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group
Morning
Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group
Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group
Base Materials
3-12A Metallic Foil Task Group
Cleaning and Coating
5-32G Residue Assessment Task Group
Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group
Rigid Printed Board
D-31B IPC-2221 Task Group
D-33AA IPC-6012 Automotive Addendum Task Group
Afternoon
Product Assurance
7-31N Manual Magnification Aides Task group
7-31R IPC-HDBK-630 Task Group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee
Printed Electronics
D-67 Additively Manufactured Electronics Subcommittee
Assembly and Joining
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group
Cleaning and Coating
5-31D Cleaning Handbook Task group
Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19F Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions Task Group
Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan
High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee
Testing
7-12 Microsection Subcommittee
Morning
Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Printed Electronics
D-60 Printed Electronics Committee
Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group
Cleaning and Coating
5-33A Conformal Coating Task Group
Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group
Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee
Afternoon
Assembly and Joining
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group
Base Materials
3-11J Metal Based Laminates for Printed Boards
Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group
Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee
High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee
3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group
Morning
Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Afternoon
Rigid Printed Boards
D-31E Depaneling Technology Task Group
WHO SHOULD ATTEND
IPC Builds is for everyone with a stake in how electronics get made today and in the years ahead, including:
- Engineers and technologists working to IPC standards daily
- Quality, reliability, and compliance professionals
- OEMs, EMS providers, board fabricators, designers, suppliers, and academia on the front lines of emerging technologies
- Trainers and educators who teach to IPC standards
- Forward-thinking professionals ready to help forecast and shape next-generation standards
- Industry newcomers ready to collaborate and network with the best in the business
If IPC standards affect your work. IPC Builds 2026 is where you belong.
CLAIM YOUR SEAT IN PARIS – REGISTER NOW
Advance Registration
Process: Advanced registration is mandatory for all attendees.
There is no registration fee for this event.
On-site Registration
On-site registration will be available for last-minute participants, but we do encourage advance registration.
HOTEL & VENUE
H4 Hotel Wyndham Paris Pleyel Resort | 149 Boulevard Anatole-France, 93200 Saint-Denis, France
A modern conference venue just outside central Paris, with dedicated meeting spaces, full hotel capacity, and easy access to the city. Use the dedicated room block link to secure your rate. Rooms are payable at check-in.
Room block deadline: August 20, 2026. Rooms not reserved by that date will be released. Book early… this is Paris in September. Free cancellation or modification until August 20, 2026.
QUESTIONS?
Philippe Léonard | Europe Director | PhilippeLeonard@electronics.org
Anatolii Kazmin | Europe Event Manager | anatoliikazmin@electronics.org
Teresa Rowe | Senior Director, Industry Standards | TeresaRowe@electronics.org