Advanced Electronic Packaging Technology Council (ADEPT)
About the Council
The Advanced Electronic Packaging Technology Leadership Council (ADEPT) serves as a collaborative platform uniting industry leaders and Global Electronics Association to advance component and system-level packaging across high-impact sectors like AI/Data Centers, Automotive, Industrial, and Aerospace. Through focused discussions on design, materials, reliability, and manufacturing, the council drives roadmap contributions, standards development, and expert engagement across the electronics ecosystem.
How can you help:
- Share technical insights to influence next-gen packaging solutions
- Help shape industry roadmaps and strategic direction
- Represent your organization through thought leadership opportunities
- Collaborate with peers across sectors to solve common challenges
- Drive education and standards that support your workforce needs
Adept is a collection of the electronic industry's top technology contributors and experts serving various industry markets and representing: Design/Modeling/Simulation, Materials, Assembly & Testing, Reliability/Metrology, and Manufacturing expertise. Members consist of CTOs, Engineering VPs, Directors, fellows, Distinguished Engineers, Senior Technical Staff members, and Chief Engineers.
Council Structure
General Council Members - 20-30 members selected from various supply chain segments, OEM, EMS, PCB, and key Global Electronics Association member companies. Council members will consist of members from the following technology leadership roles:
- Chief Technology Officers
- Vice Presidents Engineering/R&D/Operations
- Directors Engineering/R&D/Operations
- Engineering Fellows
- Distinguished Engineers/Technologists
- Senior Technical Staff Members
- Chief Engineers
Intent
The intent of ADEPT is to collaboratively identify and develop industry guidance and solutions on advanced packaging challenges facing industry via roadmap contributions, standard development, and expert engagement across the electronics ecosystem.
Objectives
- Act as a networking platform amongst the industry experts and the Global Electronics Association in electronic packaging, both at the component and system levels.
- Make roadmap contributions as appropriate in collaboration with other roadmap organizations
- Serve as an expert panel resource for reputed industry conferences/meetings/workshops
- Provide reviews and input to white papers released with industry endorsements
- Explore opportunities for updating existing standards and/or developing new guidelines/standards
Scope
- Design/Modeling/Simulation, Materials, Assembly and Test, Reliability/Metrology, and Manufacturing
- High-performance compute, power, analog, and mixed signal, including wireless connectivity
- Data Center/AI, Automotive and Industrial, Aerospace and Defense
Council Members -
- Elizabeth Benedetto, Hewlett-Packard
- Mark Gerber, ASE
- Gary Brist, Siemens EDA
- Madhu Lyendar, Google
- Rajen Murugan, TI
- Ravi Mahajan, Intel
- James Fuller, Sanmina
- Dale Lee, Plexus Corporation
- Andrew Collins, Intel
- Jim Will, USPAEl
- Siva Sivasankar, Google
- Brian Toleno, Meta
- Jan Vardaman, TechSearch International
- Larry Pymento, Intel
- Jennifer Waskow, Collins Aerospace
- Udo Welzel, Bosch
- Jung Yoon, IBM Corporation
- Keith Newman, AMD
Adept is a collection of the electronic industry's top technology contributors and experts serving various industry markets and representing: Design/Modeling/Simulation, Materials, Assembly & Testing, Reliability/Metrology, and Manufacturing expertise. Members consist of CTOs, Engineering VPs, Directors, fellows, Distinguished Engineers, Senior Technical Staff members, and Chief Engineers.
Council Structure
General Council Members - 20-30 members selected from various supply chain segments, OEM, EMS, PCB, and key Global Electronics Association member companies. Council members will consist of members from the following technology leadership roles:
- Chief Technology Officers
- Vice Presidents Engineering/R&D/Operations
- Directors Engineering/R&D/Operations
- Engineering Fellows
- Distinguished Engineers/Technologists
- Senior Technical Staff Members
- Chief Engineers
Intent
The intent of ADEPT is to collaboratively identify and develop industry guidance and solutions on advanced packaging challenges facing industry via roadmap contributions, standard development, and expert engagement across the electronics ecosystem.
Objectives
- Act as a networking platform amongst the industry experts and the Global Electronics Association in electronic packaging, both at the component and system levels.
- Make roadmap contributions as appropriate in collaboration with other roadmap organizations
- Serve as an expert panel resource for reputed industry conferences/meetings/workshops
- Provide reviews and input to white papers released with industry endorsements
- Explore opportunities for updating existing standards and/or developing new guidelines/standards
Scope
- Design/Modeling/Simulation, Materials, Assembly and Test, Reliability/Metrology, and Manufacturing
- High-performance compute, power, analog, and mixed signal, including wireless connectivity
- Data Center/AI, Automotive and Industrial, Aerospace and Defense
Council Members -
- Elizabeth Benedetto, Hewlett-Packard
- Mark Gerber, ASE
- Gary Brist, Siemens EDA
- Madhu Lyendar, Google
- Rajen Murugan, TI
- Ravi Mahajan, Intel
- James Fuller, Sanmina
- Dale Lee, Plexus Corporation
- Andrew Collins, Intel
- Jim Will, USPAEl
- Siva Sivasankar, Google
- Brian Toleno, Meta
- Jan Vardaman, TechSearch International
- Larry Pymento, Intel
- Jennifer Waskow, Collins Aerospace
- Udo Welzel, Bosch
- Jung Yoon, IBM Corporation
- Keith Newman, AMD