Connecting the Dots: From Component-Level to System-Level Packaging at the IEEE HIR Symposium
Key Summary:
- At the IEEE Electronics Packaging Society Annual HIR Symposium, the Global Electronics Association addressed the transition from component-level to system-level packaging.
- Contributions to the International Heterogeneous Integration Roadmap focus on assembly and reliability challenges in high-performance compute and analog/mixed-signal applications.
- Advanced packaging is enabling silicon photonics, optical interconnects, and co-packaged optics for next-generation data center performance.
- Liquid cooling is becoming foundational for high-performance computing architectures.
- Expanded global collaboration, including engagement through HIR and international partners, strengthens industry alignment and roadmap-driven innovation.
By Devan Iyer, Chief Strategist, Advanced Electronic Packaging, Global Electronics Association
At the recent IEEE Electronics Packaging Society Annual HIR Symposium, I had the opportunity to speak about a topic at the center of advanced electronic packaging: bridging the gap between component-level and system-level packaging.
The International Heterogeneous Integration Roadmap (HIR)
HIR is a trusted compass for our industry, outlining projected technological needs and innovation opportunities over the next 10-15 years. Unlike commercial forecasts, HIR focuses on technical assessment, identifying challenges, research gaps, and the possible solutions required to integrate emerging devices and materials at scale. For many, it’s the first place we look to understand where the industry is heading.
As functionality integration intensifies, the transition between these stages becomes increasingly complex due to higher performance needs, decreasing form factors, and finer interconnect pitches. I presented on the assembly and reliability challenges that arise when moving from individual packaged components to fully realized system architectures.
Through our Advanced Electronic Packaging Technology Leadership Council (ADEPT), the Global Electronics Association collaborates with industry leaders to address these issues. In 2025, our members contributed to two HIR chapters, including assembly and reliability, covering critical package-board interactions in high-performance compute and analog/mixed-signal applications. This work represents a major step forward in aligning component innovation with system performance and reliability.
Our presence at the symposium was important as it built on the work we have done in the past year. Following an invitation to host a special session together with HIR at the 2025 Electronic Components and Technology Conference (ECTC), widely regarded as the premier global conference in advanced packaging, we expanded the conversation internationally. Also in 2025, we organized a workshop and engaged with partners in Taiwan and Malaysia. Each stop strengthened our network and sharpened our understanding of where the opportunities are. A blog entry on advanced electronic packaging in Malaysia can be found here.
Top Three Highlights from the HIR Symposium
- High-Speed Communication & Optical Interconnects
Data center performance demands are accelerating the adoption of silicon photonics, optical interconnects, and co-packaged optics. Advanced packaging will be pivotal in enabling this architecture. - Liquid Cooling is a Necessity
For high-performance computing, liquid cooling is no longer optional; it is foundational. The Association is actively developing guidelines and standards to support implementation. - Collaboration Drives Impact
The partnership between the Global Electronics Association and IEEE’s HIR teams is increasing visibility and strengthening industry alignment. Collaboration ensures that roadmap insights translate into actionable progress.
What’s Next?
Looking ahead, we want to expand our technical contributions to the HIR Roadmap into the automotive, aerospace, and defense markets. We have been invited to contribute to an extension of the automotive chapter, with a specific focus on electronics packaging for electric vehicles, and we will begin that work this year.
We are proud to be part of a robust global community of companies that contribute insights, identify challenges, and collaborate on solutions. That visibility matters. Roadmaps only work when the full supply chain participates, all building toward shared technical goals.