E-Mobility Conference 2022: IPC APEX EXPO
By Tracy Riggan, senior director, business development
Key Summary
• E-Mobility introduces new design and reliability challenges across automotive and transportation sectors
• IPC APEX EXPO 2023 features multiple technical sessions focused on high voltage, extreme environments, coatings, and failure analysis
• Experts from Rivian, TTM Technologies, Bosch, IBM, and others will present research on reliability and materials
• IPC task groups are advancing high voltage and automotive-related manufacturing standards
• Professional Development Workshops will cover press-fit technologies and design applications
• An E-Textiles Conference will also be hosted for those developing advanced vehicle systems
E-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e-Mobility presents new challenges that the electronics supply chain is working together to resolve.
You can find the latest information on e-Mobility at several technical sessions at IPC APEX EXPO 2023.
The IPC APEX EXPO Technical Conference will host an engaging special session focused on e-Mobility touching on supply chain and technology issues. The e-Mobility Special Session includes speakers and panelists from Rivian. Overall, the technical conference offers many technical papers advising on assembly and design for high reliability. A few highlights include
- S02: EX 1- High Reliability for Extreme Environments 1 including a paper by Dr. Walter Olbrich, TTM Technologies, titled “Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness”
- S06: EX 2- High Reliability for Extreme Environments 2 with a presentation from Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
- S23 EM3-C&C Electronic Materials Cleaning and Coating 1 including a paper from Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH on “Investigation of the Electrochemical Reliability of Conformal Coatings under High Voltage
- S25: QRTI-Assembly Risk Prediction and Failure Analysis including a paper, “Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation,” by Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
IPC standards development task groups will be diligently working to advance manufacturing and design standards in the areas of high voltage. The test methods task group will celebrate the release of the new test method for high voltage testing. Task groups of interest are the 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum, 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group, D-33AA: IPC-6012 Automotive Addendum, or 5-21M: Cold Joining/Press-fit Task Group.
Professional Development Workshops take place on Sunday, January 22, and Monday, January 23, including PD28: Press-fit Technology - Value Chain, Physics, Process and Standards which provides insight into the production, design, and application of compliant press-fit pins and components as well as new materials and surface finish technologies.
In addition, of interest to those electrifying and advancing systems within vehicles, IPC is hosting an E-Textiles Conference, collocated with IPC APEX EXPO on Sunday January 22.
The conference highlights design and manufacturing challenges related to e-Mobility, with expert sessions on reliability, high voltage systems, coatings, materials, and failure analysis across automotive and transportation applications.
Presenters include leaders from Rivian, TTM Technologies, Bosch, MacDermid Alpha, and IBM who will share new research on EV powertrain reliability, coatings, and material behavior.
Key task groups include the J-STD-001 and IPC-A-610 Automotive Addendum group, the IPC/WHMA-A-620 High-Voltage Cable Addendum group, the IPC-6012 Automotive Addendum group, and the Cold Joining/Press-fit Task Group.
Yes. Professional Development workshops on January 22 and 23 include a detailed session on press-fit technology covering value chain, physics, process requirements, materials, and applications.