EU Chips Research Funding Bridges Lab-to-Fab Gap
Key Summary
• EU allocates first Chips Act funding to pilot lines supporting lab-to-fab semiconductor innovation
• Imec, CEA-Leti and Fraunhofer selected to lead pilot line development
• Pilot lines enable faster commercialization of next-generation semiconductor technologies
• One pilot line dedicated to advanced heterogeneous systems integration
• Initiative strengthens Europe’s long-term competitiveness in semiconductor research and production
In early April, the European Commission took another step in advancing semiconductor technology by allocating the first tranche of funding for “pilot lines” under the European Chips Act. Managed by the Chips Joint Undertaking, which oversees the EU's investment in chips research, this allocation marks a pivotal moment in the region's technological advancement. Following a rigorous selection process, Imec, CEA-Leti, and Fraunhofer have emerged as key players among the Research and Technology Organizations (RTOs) entrusted with running these pilot lines. These lines will serve as crucial bridges “from lab to fab,” facilitating the transition of cutting-edge technologies from conception to commercialization. One of the pilot lines will specifically focus on advanced heterogeneous systems integration, highlighting the EU's commitment to fostering innovation across diverse domains within the semiconductor industry. Read the press release from Chips Joint Undertaking. IPC Contact: Alison James.
The pilot lines are meant to bridge the gap between research breakthroughs and commercial semiconductor production, helping new technologies move from early development into practical manufacturing.
Imec, CEA-Leti, and Fraunhofer were chosen through a competitive evaluation process and will lead several pilot lines across different areas of semiconductor innovation.
Heterogeneous integration enables combining multiple technologies within a single package, improving performance and efficiency. This area is crucial for advanced chips used in AI, automotive and high-performance computing.
The funding directly contributes to the Chips Act goal of strengthening Europe’s semiconductor ecosystem by expanding R&D capacity and improving pathways to manufacturing.
By investing early in commercialization infrastructure, the EU aims to reduce reliance on foreign production, accelerate innovation and strengthen its role in the global semiconductor supply chain.