Fabrication and Assembly Challenges to be Covered at the Executive Forum for Advancing Automotive Electronics at IPC APEX EXPO 2019

Jan 07, 2019

Key Summary

• The presidential determination recognized PCBs, advanced packaging, and IC substrates as critical defense technologies
• FY24 funding preserved DPA resources, including support for domestic PCB fabrication
• Two IPC member companies received major DPA awards for IC substrates and advanced packaging
• IPC urges a full U.S. commitment to a silicon to systems strategy rather than a chips only focus
• FY25 budget concerns threaten momentum due to reduced DPA funding and no new PCB allocations

Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to produce fine lines and dissipate heat. Tier 1 providers will discuss what is expected and what they are doing to improve reliability. Industry icons from Asia and Europe will join American leaders to provide information to help you meet tomorrow’s fabrication and assembly challenges. This not-to-be-missed event will be held at IPC APEX EXPO 2019 on January 28 in San Diego. Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org. For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.

Q:
What progress has occurred since the presidential determination on defense electronics?
A:

The FY24 spending deal preserved DPA funding, key language supported domestic PCB fabrication, and two IPC member companies received major investments to expand IC substrate and advanced packaging capabilities.
 

Q:
Why does IPC stress the need for a silicon to systems strategy?
A:

Chips cannot function alone. They must be mounted on PCBs and integrated with other components. Without strengthening the full ecosystem, advanced chips produced in the U.S. will still require overseas packaging and assembly.
 

Q:
What investments were awarded to IPC member companies under the DPA?
A:

Calumet Electronics received $39.9 million for high density build up substrates, and Green Source received $46.2 million to expand IC substrate, HDI, UHDI, and advanced packaging production.
 

Q:
What concerns exist about future funding for electronics manufacturing?
A:

The FY25 budget proposal reduces DPA funding by 33 percent and adds no new resources for PCBs or advanced packaging, which risks stalling progress made in recent years.
 

Q:
Why is continued government investment important for the electronics ecosystem?
A:

Sustained funding is needed to build U.S. capabilities in substrates, PCBs, and advanced packaging. Without it, the nation remains vulnerable to supply chain disruptions despite increased chip production.