How Better Materials, not Just Better Chips, Drive EV Performance

KEY SUMMARY:

• EV performance is shifting from a semiconductor-only focus to a system-level approach integrating materials, packaging, thermal management, and manufacturing. 
• Insights from APEX EXPO 2026 underscore the role of advanced materials, including silicon carbide (SiC), along with improved thermal interfaces and high-voltage contamination control. 
• Companies that align materials science, design, and precision manufacturing will lead the next wave of EV power electronics innovation.

By Stan Rak, SF Rak Company, APEX EXPO Technical Program Committee Co-chair

At APEX EXPO 2026, one message came through clearly: improving electric vehicle (EV) performance isn’t just about better semiconductors – it’s about everything around them: materials, packaging, heat management, and manufacturing precision.

As automakers push toward higher voltages and more powerful systems, these supporting technologies are becoming real differentiators.

Beyond the Chip

Work presented by Lars Böttcher of Fraunhofer IZM Berlin showed how silicon carbide (SiC) devices continue to enable faster, more efficient power electronics. But simply using better chips isn’t enough.

New approaches, like embedding power devices directly into circuit boards and replacing traditional wire connections with solid copper, are reducing energy loss and improving reliability. The result: smaller, more efficient systems that can handle higher power.

What this means: Better packaging is as important as better semiconductors.

Materials are a Competitive Advantage

In his presentation, Dr. Michael Jörger of Heraeus Electronics detailed how materials were once a background consideration. That’s no longer the case.

To handle higher speeds, temperatures, and voltages, manufacturers need materials that can:

• Conduct electricity efficiently 
• Move heat away quickly 
• Stay stable under stress 

This is driving changes across substrates, interconnects, and manufacturing processes—and requiring closer coordination across the supply chain.

What this means: Materials selection is a key driver of performance, not just a cost decision.

Heat is the Limiting Factor

A presentation by Emin Skiljan of Indium Corporation detailed how, as power increases, so does heat, a major constraint on performance and reliability.

New thermal interface materials (the layers that transfer heat from components) are showing significant improvements, offering better heat transfer and more consistent long-term performance than traditional options.

What this means: The ability to manage heat effectively will determine how far performance can scale.

Cleanliness Matters More at High Voltage

Research presented by Jeffrey Kennedy of ZESTRON Europe showed that at higher voltages (400–800V and beyond), even tiny contaminants can cause failures.

What’s changing is how cleanliness is measured. It’s no longer enough to count particles—manufacturers must understand whether those particles can actually conduct electricity and trigger failures.

What this means:  Reliability depends on understanding which contaminants matter, not how many.

Everything is Now Connected

Work from Rajesh Mandamparambil, NXP Semiconductors, and others highlighted that power electronics are no longer standalone components. They’re increasingly integrated with sensors, controls, and other vehicle systems.

That creates new challenges:

• More heat concentrated in smaller spaces 
• More complex packaging approaches 
• Higher reliability expectations tied to safety 

What this means: Power electronics must be designed as part of the full vehicle system, not in isolation.

The Bottom Line

The path to higher-performance EV power electronics is no longer just about advancing semiconductor devices. It requires coordinated progress across materials, packaging, thermal management, and manufacturing.

Companies that can bring all these elements together, rather than optimizing them separately, will have the advantage.

Read More

The industry continues to shift toward system-level reliability, where materials, packaging, thermal management, and cleanliness define performance. These topics will be explored in SMT007’s upcoming Road to Reliability series.