iNEMI Shares Hybrid PCB Survey Results
Hybrid PCB Survey Results Webinar
April 26 & 27, 2022
Key Summary
• iNEMI identified hybrid PCB reliability as a critical issue for high-frequency applications
• Hybrid PCBs combine standard laminates with low-loss dielectrics but introduce manufacturing and durability challenges
• Survey responses from laminate makers, PCB fabricators, and OEMs reveal common reliability risks
• Webinar will present utilization metrics, manufacturing insights, and potential collaborative project topics
• Two global webinar sessions require advance registration
iNEMI’s PCB & Laminates Technology Integration Group (TIG) has identified thermoset hybrid PCB reliability as a critical focus area. Combining standard laminates with layers of low loss dielectric materials can provide the electrical performance required to meet an increasing range of high frequency applications at minimum cost. However, this combination of dissimilar resin materials has associated challenges for PCB manufacturing processes and can result in a reduction in durability and reliability, often only apparent as a field failure.
The PCB & Laminates TIG surveyed some of the industry’s top laminate manufacturers, PCB fabricators, and OEMs/ODMs to better understand hybrid PCB utilization and some of the common challenges associated with manufacturing hybrid PCBs. This webinar will present an analysis of the survey responses, including metrics on hybrid PCB utilization along with insights into hybrid PCB manufacturing challenges and their implications for hybrid PCB design. Suggestions for future collaborative projects related to hybrid PCBs will also be presented and attendees will have the opportunity to offer input on specific interests.
Registration
This webinar is open to industry; advance registration is required. Two sessions (with the same content) are scheduled — see registration links below. Get additional details about the webinar, and if you have any questions, please contact Steve Payne (steve.payne@inemi.org).
Session 1 (Americas/Europe)
Tuesday, April 26
12:00-1:00 p.m. EDT (Americas)
6:00-7:00 p.m. CEST (Europe)
Session 2 (APAC)
Wednesday, April 27
7:00-8:00 a.m. CST (China)
7:00-8:00 p.m. EDT on April 26 (Americas)
It examines how hybrid PCBs are used and the manufacturing challenges that arise when combining dissimilar dielectric materials.
Different resin systems can behave unpredictably in processing, creating durability and reliability issues that may only appear in the field.
Top laminate suppliers, PCB fabricators, and OEMs/ODMs contributed insights on usage trends and common issues.
It will present survey metrics, outline manufacturing challenges, explain their design implications, and suggest future collaborative project areas.
Anyone may attend by registering in advance for one of the two scheduled sessions covering Americas/Europe and APAC time zones.