IPC Applauds White House’s Microelectronics Strategy
Key Summary
• The White House released a National Strategy on Microelectronics Research aligned with the CHIPS Act
• The strategy outlines ambitious U.S. microelectronics objectives for the next five years
• IPC welcomed the focus on advanced packaging, test, and assembly
• The strategy highlights the need for a supportive ecosystem including materials, substrates, and interconnects
• IPC’s 2021 advanced packaging report was cited as a guiding reference
• IPC plans to use the strategy to reinforce its silicon to systems advocacy
In March, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States. Aligned with the bipartisan CHIPS Act, the National Strategy on Microelectronics Research sets forth ambitious objectives for the coming five years. IPC was pleased to see advanced packaging, test, and assembly mentioned, and the emphasis on fostering a supportive ecosystem including materials, substrates, and interconnect technology was on target. IPC’s 2021 report on advanced packaging was also cited as a guiding reference. You can be sure IPC will refer to this strategy often as our advocacy continues, emphasizing a “silicon-to-systems” approach. IPC Contact: Rich Cappetto
It aims to accelerate U.S. microelectronics innovation over the next five years in alignment with the CHIPS Act.
IPC welcomed the inclusion of advanced packaging, test, and assembly, which are critical components of a strong microelectronics ecosystem.
It stresses the importance of materials, substrates, and interconnect technologies to support innovation and manufacturing.
OSTP cited IPC’s 2021 advanced packaging report as a reference, reflecting IPC’s contributions to industry guidance.
IPC will rely on it in ongoing advocacy to promote a silicon to systems approach across the electronics manufacturing landscape.