IPC, European Parliament Work to Bolster European Chips Act

Sep 30, 2022

Key Summary

• IPC is collaborating with European Parliament leaders to strengthen the European Chips Act
• MEP Eva Maydell emphasized the need to grow Europe’s advanced packaging capabilities
• Europe currently holds only 5% of global packaging capacity, highlighting a major gap
• IPC is advocating for clear definitions and stronger support for advanced packaging R&D and manufacturing
• IPC stresses that the Chips Act should be the first step toward building a robust European electronics ecosystem

Last week, Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. 

That’s good news for the electronics industry given the important role that MEP Maydell plays in the European Parliament’s ongoing deliberations on the Chips Act. She is the EPP Group Rapporteur on the Chips Act and the Rapporteur on the Chips Joint Undertaking.

In her remarks to IPC members, she noted that Europe commands only 5% of packaging capability globally, a percentage that will need to increase given the criticality of advanced packaging for performance as well as lower energy consumption. Always a champion for innovation, she also offered to continue to work with IPC and the European electronics industry in the lead-up to her draft report on the Chips Joint Regulation.

IPC has been in touch with MEP Maydell and with many of her colleagues to bolster the Chips Act by providing: 

  • A definition for advanced packaging that includes assembly and test, IC substrate fabrication, and embedded components
  • Greater affirmative support for investments in advanced packaging R&D and industrial capacity
  • Greater articulation that the Chips Act is the 1st step in a process of strengthening Europe’s electronics manufacturing ecosystem. 

IPC is working with our members and industry peers to secure greater support within the European Parliament. If you're interested in learning more about IPC’s efforts, please contact me at AlisonJames@ipc.org.   

 

Q:
Why is IPC engaging with the European Parliament on the Chips Act?
A:

IPC is working with key policymakers to ensure the Chips Act supports the entire semiconductor ecosystem, including critical areas like advanced packaging, assembly, and substrate fabrication.
 

Q:
What concern did MEP Eva Maydell highlight about Europe’s current capabilities?
A:

She noted that Europe accounts for only 5% of global packaging capacity, which must increase to meet performance and energy-efficiency needs in modern semiconductor technologies.
 

Q:
How does IPC want advanced packaging defined in the Chips Act?
A:

IPC recommends a definition that includes assembly and test, IC substrate fabrication, and embedded components to ensure all essential activities are recognized and supported.
 

Q:
What types of investments is IPC urging the EU to prioritize?
A:

IPC is calling for stronger investment in advanced packaging research, development, and industrial capacity to help Europe compete globally.
 

Q:
How does IPC view the Chips Act within the broader strategy for European electronics manufacturing?
A:

IPC sees the Chips Act as a first step toward strengthening Europe’s full electronics ecosystem and believes sustained policy support will be necessary to build long-term resilience.