From Silicon to Systems: The Technical Depth Behind APEX EXPO 2026
By Chris Jorgensen, Senior Director, Next-Generation Technologies, Global Electronics Association
Key Summary
- APEX EXPO 2026’s Advanced Electronic Packaging Conference delivers 80+ peer-reviewed technical papers focused on real-world advances in packaging, PCB fabrication, materials, reliability, AI-enabled automation, and next-generation assembly.
- Opening keynotes from IBM and Intel highlight how advanced packaging, SMT, and heterogeneous integration are enabling next-generation compute, from AI to quantum systems.
- Unmatched technical depth across 25 sessions provides practical insights that help engineers improve yields, accelerate time to market, and make informed manufacturing decisions.
- Special sessions on aerospace, defense, EVs, and autonomous vehicles address high-reliability, high-performance applications shaping the future of electronics manufacturing.
Every year at APEX EXPO, I get a clear view of where electronics innovation is truly headed. Not from marketing slides, but from peer-reviewed research, hard data, and candid engineering conversations.
That reality will be front and center at the Advanced Electronic Packaging Conference at APEX EXPO 2026. Simply put: if performance, reliability, and competitive differentiation matter to you, this is where you need to be.
Why this conference matters
- 80+ original technical papers presented March 16–19
- New methods, unpublished results, and practical insights you can apply immediately
- Coverage spans advanced packaging, PCB fabrication, materials, reliability, sustainability, AI-enabled automation, and next-generation assembly
This isn’t theoretical work. Attendees consistently leave with ideas that improve yields, shorten time-to-market, and shape real product and manufacturing decisions.
Opening Session: Next-Gen Compute Starts Here
Monday, March 16 | 1:30–5:30 pm
The conference opens with two must-see technical keynotes:
- Dr. David Lokken-Toyli (IBM): From Silicon to Systems, how packaging and SMT are scaling for heterogeneous integration, quantum systems, and emerging compute platforms
- Dr. Ravi Mahajan (Intel): Advanced packaging as a critical enabler for heterogeneous integration, interconnect scaling, and industry–academia collaboration
They’re followed by expert presentations and a panel featuring leaders from IBM, AMD, Flex, and ASMPT.
Deep technical education, unmatched
Tuesday–Wednesday, March 17–18
- 80+ papers across 25 sessions
- Topics include electrical and thermal design, surface finishes, SMT, power electronics, metrology, quality and reliability, sustainability, and factory automation
You will be hard-pressed to find another conference this year with this level of technical rigor and breadth.
Thursday Special Sessions: High-Stakes Applications
March 19
- Aerospace & Defense Electronics | 8:30–11:00 am
- EV and Autonomous Vehicle Electronics | 11:30 am–2:30 pm
These sessions bring together experts from across the supply chain to address the unique challenges of advanced packaging in the industry’s most demanding environments.
More than content—community
Just as valuable as the presentations are the conversations between them. Engineers, technologists, suppliers, and standards leaders from around the world come together to compare notes, debate tradeoffs, and look ahead.
As Matt Kelly, APEX EXPO Conference General Chair notes, this year’s program targets the most critical issues shaping electronics, from component- and system-level integration to sustainability and automation.
If you want to stay ahead of the curve instead of reacting to it, Anaheim is where the industry will be this March.
Advanced Electronic Packaging Conference at APEX EXPO 2026
March 16–19, 2026
Anaheim Convention Center | Anaheim, California
Registration is open now. I encourage you to secure your place and be part of the conversations defining the next generation of electronics.