Global Electronics Association Knowledge Hub

The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the i .. weiterlesen

With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board .. weiterlesen

It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in .. weiterlesen

Additive manufacturing (AM) methods to fabricate and repair printed hybrid electronic (PHE) components and interconnect systems create compelling opportunities in 3D curvilinear architecture .. weiterlesen

Lower temperature soldering has been regarded as one of the most effective ways to reduce warpage risk. Use of lower-temperature solders, including a BiSnAgCu eutectic and two In-containing, .. weiterlesen

Gallium-based liquid metals have remarkable properties: melting points below room temperature, wide conductivity, water-like viscosity, low toxicity, and effectively zero vapor pressure (the .. weiterlesen

Voiding and solder coverage in SMT solder joints remain a matter of (sometimes emotional) debate in automotive electronics. Meanwhile voiding/solder coverage requirements have been introduce .. weiterlesen

At present, with the rapid change of the server market, Eagle Stream platform chipset, which changes the traditional practice of Whiley platform material selection and stack mode compared wi .. weiterlesen

The 4-14F IPC Standards Committee are close to finalizing (at the time of writing) a revision to the IPC 4556 specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPI .. weiterlesen

Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One solution for board-level thermal management i .. weiterlesen

In advanced printed circuit board and IC substrate production, the metallization for blind vias and through vias (also called through holes – TH) is essential for the build-up of the PCB or .. weiterlesen

In HDI (high density interconnect) PCB (printed circuit board) and IC Substrate (integrated circuit substrate), a successfully formed and plated laser via is crucial to the overall system an .. weiterlesen

Flip chip ball grid array (FCBGA) package substrate components provide the critical building blocks for electronic devices and high-performance computers. They will enable the future of supe .. weiterlesen

The need for cleaning circuit card assemblies is well understood for achieving optimum reliability; contamination present on assemblies can lead to detrimental effects, including dendritic g .. weiterlesen

Direct Digital Manufacturing (DDM) is a growing field in which Additively Manufactured Electronics (AMEs) are manufactured on a single machine through a variety of additive and subtractive t .. weiterlesen

Thorough cleaning processes are necessary due to their critical role in ensuring optimal system performance. Residual contaminants can significantly compromise printed circuit card assemblie .. weiterlesen

Additive Manufacturing (AM) offers numerous benefits over traditional manufacturing methods, such as realization of unique form factors, decreased waste in material, decreased cost and lead .. weiterlesen

At millimeter-wave frequencies, considerations of electrical performance and PCB durability may often lead to contradictory requirements with respect to copper foil materials and chemical pr .. weiterlesen

As the electronics industry continually strives for innovation and efficiency in assembly and rework processes, the exploration of low temperature (LT) solder alloys has gained significant a .. weiterlesen

The global interest in reducing CO2, as demonstrated by carbon neutrality, is growing in order to achieve a low-carbon society. Electronic packaging industry is seeing the importance of SnBi .. weiterlesen

Solder paste jetting is a popular and innovative method for applying solder paste in electronic assembly, especially for modern, miniaturized, and complex electronic assemblies. This techniq .. weiterlesen

Continuous pursuits for higher data rate, larger network capacity, lower latency communication, and better energy efficiency have motivated the rapid development of high-frequency communicat .. weiterlesen

Laser depaneling is a relatively clean separation process but nevertheless the knowledge of potential influence factors on the technical cleanliness is of central importance to find the opti .. weiterlesen

The multilayer PCB is prone to poor expansion and shrinkage due to the influence of high temperature and high pressure during lamination process, which may cause risk of abnormal quality. Th .. weiterlesen

In laptop and tablet CPU/GPU applications, package thickness tends to be thinner since it brings lighter weight, lower product thickness, and shorter interconnection distance. To decrease pa .. weiterlesen

The reflow soldering performance of polymer aluminum electrolytic capacitors have a direct impact on their electrical performance. By analyzing the mechanism of capacitor bulges, improve the .. weiterlesen

Flip chip BGA, interconnect with semiconductor chips and mainboards, to serve the interconnection of electronic products. This paper is about the study of one of the important warpage modula .. weiterlesen

In the pursuit of ever finer lines and spaces to advance technology's power and efficiency, the substrate and substrate-like production processes must adapt to meet these demands while caref .. weiterlesen

The protection of metallic substrates from reactive environments is necessary for semiconductor packages, which are mainly made of copper metal. Conventionally, plating with novel metals suc .. weiterlesen

This study is part of a series of papers on mitigation of voids in solder joints. Voiding is an ongoing concern for printed circuit board assembly (PCBA) manufacturers. As bottom terminated .. weiterlesen

ETS (Embedded Trace Substrate) is one of advanced substrate design that enable to make fine width and space. The Cu trace open defect on ETS layer (L01) revealed by this OSP micro etching is .. weiterlesen

The explosion of data in the 4th Industrial Revolution has increased the importance of high-performance computing (HPC). HPC requires high-density I/O count to be formed in small area, but t .. weiterlesen

Sn-58Bi lead-free low-temperature solder (LTS) is regarded as a candidate for low-temperature assembly of electronics components, but its usage field is limited in Surface Mount Technology ( .. weiterlesen

Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process, which have a significant impact on the reliability of PCB products. In th .. weiterlesen

Chiplet technology is rapidly applied to the latest devices as high performance of semiconductor devices is required. As chiplet becomes vibrant, IC packaging substrates become bigger and mo .. weiterlesen

Applications for dielectric materials are becoming ever more demanding and complex, requiring careful planning & material selection by original equipment manufacturer (OEM) designers tha .. weiterlesen

The growing demand for high-performance and compact electronic devices has led to increasing power densities, resulting in thermal challenges that impact packaging, performance, and reliabil .. weiterlesen

Today, the evaluation of circuit board assembly materials extends beyond their technical performance. An increasingly important aspect of this evaluation centers on whether the material help .. weiterlesen

Polycarbonate/Acrylonitrile butadiene styrene (PC/ABS) blends are widely used engineering thermoplastic materials in electronic applications for TV frames, computer peripherals, phone housin .. weiterlesen

Thermal-aging induced crack formation of fiber-reinforced polymer composites in printed circuit boards (PCBs) is a major failure mode affecting the reliability of electronic control units as .. weiterlesen

As the data rate is getting faster with the development of applications such as High Performance Computing (HPC), Data Center, and Artificial Intelligence (AI), it is found via stubs are aff .. weiterlesen

Solder voids affect the thermal and electrical properties of solder joints, reducing their reliability. The main test for solder voids is non-destructive testing using X-ray transmission ima .. weiterlesen

Solder resist (SR) is applied to the outermost layer of printed circuit boards (PCBs) for surface protection and electrical insulation. It is crucial for the reliability of PCBs to ensure ro .. weiterlesen

Metals have long been used as thermal interface materials (TIMs). Due to their high reliability and thermal conductivity, metal TIMs are excellent solutions for heat dissipation in electroni .. weiterlesen

There is a global consensus that the environmental impact of electronics needs to be reduced. The first step towards this goal is identifying the environmental hotspots in electronics manufa .. weiterlesen

Flux which facilitates fine bump development and bump pitch was developed. The purpose was to achieve fine bump and bump pitch by securing rheological properties that are similar to, or an i .. weiterlesen

Thermosetting epoxy resin is widely used in electronic materials for its excellent insulation, heat resistance, mechanical properties, chemical resistance and processability. However, the no .. weiterlesen

2.5D is representative advanced packaging technologies that combine multiple integrated circuit dies into one package using silicon interposer. And 2.1D bridge technology, which inserts high .. weiterlesen

The July 23rd webinar, “Electronic Essentials 101: What You Think You Know – and More,” presented by Greg Merrill, offered a practical refresher on core electronics concepts like voltage, cu .. weiterlesen

This article is a series of studies on a new generation of CPU socket challenges and component interconnect technology for high-end computer product applications. These products encompass co .. weiterlesen