Global Electronics Association Knowledge Hub

In modern manufacturing, the seamless coordination and efficient control of Surface Mount Technology (SMT) production lines rely significantly on strong communication and interoperability am .. weiterlesen

When the traditional server motherboard is designed in laminated structure, in order to ensure the symmetry of laminated structure, each layer is designed with the same material. With the up .. weiterlesen

This paper first presents a summary of cycles-to-failures (CTFs) test data based on Weibull plots and failure analysis generated for small to large Quad Flat No-Lead (QFN) packages, which we .. weiterlesen

Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determi .. weiterlesen

Embedding the magnetic core into the PCB can reduce the occupation of PCB area by some inductive devices, but there is often a risk of magnetic core fragmentation and PCB delamination. This .. weiterlesen

The scope of this paper is sustainability of in-mold electronics. This technology has many benefits, such as decreasing material usage, using additive manufacturing processes and simplifying .. weiterlesen

On June 18, 2025, industry expert William Graver led an informative session on the fundamentals of PCB microsection preparation and analysis. This introductory webinar covered essential tech .. weiterlesen

June 23, 2025 began a new chapter for IPC as it officially became the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “B .. weiterlesen

This session, held on November 15, 2022, introduced the major updates in IPC/WHMA-A-620 Revision D. Attendees reviewed key changes, clarified acceptance criteria, and explored how the revisi .. weiterlesen

On November 2, 2022, this webinar covered essential best practices for wire harness manufacturing, offering practical insights to improve quality, efficiency, and reliability. Topics include .. weiterlesen

With AI rapidly transforming smart manufacturing, the May 14, 2025 webinar examined how electronics manufacturers can effectively integrate Computer Vision AI and Generative AI to boost qual .. weiterlesen

This February 12, 2025 webinar, led by John Watson, explored the growing role of artificial intelligence in revolutionizing PCB design. The session demonstrated how AI is improving speed, pr .. weiterlesen

On January 22, 2025, this webinar introduced key PCB design principles—Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). Attendees learned how applying th .. weiterlesen

This December 11, 2024 webinar showcased cutting-edge approaches for inspecting electronic assemblies using 3D X-ray microscopy, nanoscale imaging, and deep learning. Attendees learned how t .. weiterlesen

As cybersecurity threats continue to grow across global supply chains, the November 13, 2024, webinar offered a timely introduction to IPC-1792, the new standard addressing cybersecurity in .. weiterlesen

On October 31, 2024, this webinar explored the vital role of frontline response and preparedness in managing cyber threats within electronics manufacturing. Attendees learned how early detec .. weiterlesen

In this informative session held on September 18, 2024, participants explored the latest revisions to IPC-6012 and IPC-A-600—essential standards for the qualification and acceptance of rigid .. weiterlesen

On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D .. weiterlesen

In advance of his August IPC Counterfeit Electronic Parts Mitigation course, Anthony J. Bryant hosted a focused webinar on July 31, 2024, examining the critical issue of counterfeit document .. weiterlesen

On June 19, 2024, this webinar offered a comprehensive look into the PCB board fabrication process, following the journey of design artwork after it reaches the board shop. Tailored for Elec .. weiterlesen

On May 1, 2024, a panel of industry experts discussed the root causes of creep corrosion in electronics, along with relevant testing methods and effective mitigation strategies. The session .. weiterlesen

On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract .. weiterlesen

On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he .. weiterlesen

On January 10, 2024, this webinar covered best practices for minimizing and managing flux residues in electronics manufacturing. It addressed risks associated with low standoff components, m .. weiterlesen

On December 6, 2023, this webinar provided non-professional cybersecurity specialists with essential information and awareness to better understand today’s cybersecurity landscape—no extensi .. weiterlesen

On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices. .. weiterlesen

Held on October 31, 2023, this webinar featured Dr. Bev Christian presenting "Delivering Engaging Technical Presentations." The session offered practical strategies for improving the clarity .. weiterlesen

On September 28, 2023, Stanton Rak, Ph.D., presented a webinar titled "Technical Paper Writing: Industry Best Practices for Conference Manuscripts." In this session, Dr. Rak shared expert gu .. weiterlesen

On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ .. weiterlesen

This technical webinar, held on June 27, 2023, explored technologies that help wire harness assemblers reduce errors and improve efficiency. Topics included guided insertion of seal plugs an .. weiterlesen

This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610 .. weiterlesen

Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero .. weiterlesen

The webinar, presented by Mike Carano on March 29, 2023, delved into the essential considerations for implementing High-Density Interconnect (HDI) and Ultra HDI technologies in the context o .. weiterlesen

This webinar, held on March 15, 2023, covered a brief introduction to the types of machine data available in an EMS factory and how to set up an analytics environment using freely available, .. weiterlesen

On December 14, 2022, Madison Maxey, founder and technical lead of Loomia, shared highlights of her IPC APEX EXPO 2023 professional development course. The course provided a primer for elect .. weiterlesen

This webinar, held on December 7, 2022, previewed the IPC APEX EXPO 2023 professional development course, “Gold-Aluminum Wire Bonding Process, Quality and Reliability.” Dr. Syed Sajid Ahmad, .. weiterlesen

In January 2025, IPC International, Inc., the global electronics association, conducted an industry-wide sentiment survey to assess the state of sustainability efforts. Responses came from a .. weiterlesen

This two-part paper will explore how electronics suppliers within the e-mobility transportation sectors can address the exploding sustainability requirements. Part 1 contains background abou .. weiterlesen

Artificial intelligence (AI) is the theory and development of computer systems able to perform tasks that normally require human intelligence. This includes visual perception and pattern rec .. weiterlesen

IPC International, Inc. recognizes the challenges and opportunities facing companies in the electronics industry in the evolving practice of sustainability, most notably, the obligations est .. weiterlesen

As the United States turns to generative artificial intelligence (AI) to drive a wide range of manufacturing applications, it is critical to ensure the strength of assembly capabilities to r .. weiterlesen

HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with ex .. weiterlesen

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. weiterlesen

In an ever-more automated, digitized, and connected world, electronic system design has evolved from a former novel concept to an absolute necessity; it now encompasses several highly skille .. weiterlesen

Complex integrated systems (CIS) combine different types of functions—e.g., digital, analog, optical, micro-mechanical, power-related, structural—in a single system to ensure the best soluti .. weiterlesen

The electronics manufacturing industry finds itself today in a moment of change driven by the convergence of multiple independent factors that all conspire to greatly challenge the status qu .. weiterlesen

Environmental sustainability is a driving force for both consumers and businesses across many industries; the electronic sector is no exception. Sustainability reporting standards are being .. weiterlesen

The whitepaper Maximizing Returns: The ROI of Training in Electronics Manufacturing aims to provide a comprehensive analysis of how evaluating the return on investment (ROI) of training prog .. weiterlesen

Electronics manufacturers globally report that their growth is constrained by an inability to recruit, onboard, retain, and upskill workers. This white paper presents a holistic view of the .. weiterlesen

To drive digital transformation and leverage the power of data through analytics, machine learning, and artificial intelligence, enterprises need secure networks that provide mobility, real .. weiterlesen