Global Electronics Association Knowledge Hub

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th .. weiterlesen

The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar .. weiterlesen

Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t .. weiterlesen

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project .. weiterlesen

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras .. weiterlesen

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. weiterlesen

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. weiterlesen

This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short .. weiterlesen

Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes .. weiterlesen

Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly .. weiterlesen

Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive” .. weiterlesen

The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown smaller and smaller while energy demands have increased as the need for in .. weiterlesen

Smart phones are complex,costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance,the complexity of mobile devices has .. weiterlesen

The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul .. weiterlesen

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This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp .. weiterlesen

The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a .. weiterlesen

Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil .. weiterlesen

Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the testing and data is related to high-strain energy thermal cycling experime .. weiterlesen

Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da .. weiterlesen

Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto- failure would be different if different failure criteria were .. weiterlesen

The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low .. weiterlesen

Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h .. weiterlesen

With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di .. weiterlesen

The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know .. weiterlesen

In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of .. weiterlesen

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Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple .. weiterlesen

In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean .. weiterlesen

An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A .. weiterlesen

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ .. weiterlesen

The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s .. weiterlesen

Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are .. weiterlesen

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa .. weiterlesen

Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement .. weiterlesen

Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix .. weiterlesen

The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin .. weiterlesen

The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein .. weiterlesen

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. weiterlesen

Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor .. weiterlesen

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c .. weiterlesen

The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist .. weiterlesen

Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. .. weiterlesen

This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up .. weiterlesen

As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will .. weiterlesen

The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec .. weiterlesen

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s .. weiterlesen

Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are .. weiterlesen

Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha .. weiterlesen