Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. weiterlesen
Event
IPC Midwest 2007
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. weiterlesen
Event
IPC Midwest 2007
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. weiterlesen
Event
IPC Midwest 2007
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. weiterlesen
Event
IPC Midwest 2007
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. weiterlesen
Event
IPC Midwest 2007
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
.. weiterlesen
Event
IPC Midwest 2007
A Unique Process that Eliminates Solder Drossand Improves QualityP. KAY’s MS2
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. weiterlesen
Event
IPC Midwest 2007
Testing the Lead Free Compatibility of Circuit Board Materials
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. weiterlesen
Event
IPC Midwest 2007
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. weiterlesen
Event
IPC Midwest 2007
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. weiterlesen
Event
IPC Midwest 2007
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. weiterlesen
Event
IPC Midwest 2007
China RoHS-An Updated Roadmap to Achieving Compliance and Assessing Risks
(not available)
.. weiterlesen
Event
IPC Midwest 2007
A Comparison of Materials Testing Methods
Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf
.. weiterlesen
Event
IPC Midwest 2007
OEM Guideline to Selecting PCB Suppliers
Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in
place for the selection of printed circuit board suppliers. This approval pr
.. weiterlesen
Event
IPC Midwest 2007
XRF Measurement of Residual Materials in Electronics Studio
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Utilization of Buried Capacitance™:A Case Study
Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of
Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur
.. weiterlesen
Event
IPC Midwest 2007
An Integrated Registration System for High Technology Multilayer PCBs
(not available)
.. weiterlesen
Event
IPC Midwest 2007
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
(not available)
.. weiterlesen
Event
IPC Midwest 2007
An OEM’s perspective on copper dissolution in lead free assembly and rework
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Copper Removal from Plated thru Hole Barrels During Lead Free Minipot Rework
(not available)
.. weiterlesen
Event
IPC Midwest 2007
THE INFLUENCE OF THE PWB FABRICATION/ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING
(not available)
.. weiterlesen
Event
IPC Midwest 2007
North American Environmental Compliance Attitudes Towards Electronics
More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The
rest of North America? This paper will discuss the following areas and a
.. weiterlesen
Event
IPC Midwest 2007
Material Declaration Reporting - Going Proactive
Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppl
.. weiterlesen
Event
IPC Midwest 2007
Designing a Data Storage System for Environmental Compliance (Focusing on RoHS-type Legislation)
As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to
medium sized businesses continue to struggle with what data should be tracked,h
.. weiterlesen
Event
IPC Midwest 2007
Voluntary Emmisions Control Action Program VECAP
(not available)
.. weiterlesen
Event
IPC Midwest 2007
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. weiterlesen
Event
IPC Midwest 2007
Effects of BGA Rework Cycles on PCB Assembly Reliability
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Efficient Thermal Transfer for Lead-free Hand Soldering
(not available)
.. weiterlesen
Event
IPC Midwest 2007
POP New Challenges for BGA Rework with Double-Sided Lead-Free PCB’s
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
.. weiterlesen
Event
IPC Midwest 2007
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. weiterlesen
Event
IPC APEX EXPO 2007
An Update of the Regulatory,Environment,and Performance Status of Tetrabromobisphenol-A in Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is a commercial flame retardant used in rigid FR-4 printed wiring boards (PWB). It is the single largest volume brominated flame retardant in the world. In this ap
.. weiterlesen
Event
IPC APEX EXPO 2007
Death,Taxes,and Environmental Compliance: Things you can count on
The European Union passed two directives in 2003 addressing the increasing amount of waste from electric and electronic equipment: (1) Directives 2002/96/ECi – Waste Electrical and Electronic E
.. weiterlesen
Event
IPC APEX EXPO 2007
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. weiterlesen
Event
IPC APEX EXPO 2007
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. weiterlesen
Event
IPC APEX EXPO 2007
Micro Drill Bit Design on the Basis of the Combination of Theoretical Analysis,Numerical Simulation and Experimental Verification
To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp
.. weiterlesen
Event
IPC APEX EXPO 2007
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. weiterlesen
Event
IPC APEX EXPO 2007
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. weiterlesen
Event
IPC APEX EXPO 2007
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and Improves Program Stability and Quality
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
.. weiterlesen
Event
IPC APEX EXPO 2007