Global Electronics Association Knowledge Hub

Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress Test (IST). The results from this test are often used to qualify P .. weiterlesen

Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a copper salt filament allows bridging between via walls or other copper .. weiterlesen

Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly cleaning processes. The purpose of this study is to evaluate how th .. weiterlesen

The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move toward lead-free manufacturing,has initiated a closer scrutiny towards e .. weiterlesen

Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free assembly. Many CSP designs will meet the thermal cycle or thermal sho .. weiterlesen

The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs used in portable devices are subjected to harsh mechanical and ther .. weiterlesen

A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip Size Package (CSP) solder fillet. Mechanically stressing the package serves as a .. weiterlesen

When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at the turn of the millennium,and even after the bubble burst in 2001-2,tele .. weiterlesen

Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion splicing,are reported. The focus of this paper is ultra low loss spli .. weiterlesen

The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the nascent fiber-optics industry. Under the auspices of the National Electro .. weiterlesen

The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with design and manufacturing improvements,2) the market demand for next g .. weiterlesen

This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons for the automation and some of the decisions that needed to be made be .. weiterlesen

Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed circuit board designs as well as the need to minimize parasitic capacitance .. weiterlesen

This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count, large panel format multilayer printed wiring boards that are used for b .. weiterlesen

Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and pivotal technology for the PCB industry preceded only by the plate .. weiterlesen

Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed designs. A number of embedded passive technology solutions are available t .. weiterlesen

This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability printed wiring boards used in single and double sided surface mount .. weiterlesen

The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi .. weiterlesen

We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this work we have continued to characterize the performance and reliability of .. weiterlesen

Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k = 23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit .. weiterlesen

Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products for four years,and in the past year other firms have begun using this te .. weiterlesen

This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed circuit boards from a broad range of laminate materials for both t .. weiterlesen

The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully reported their total completion to Lead-free production across all facilitie .. weiterlesen

The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original draft of the legislation. A true Pb-free solution for product such .. weiterlesen

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With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count increased,the number of files increased. As trace size and spacing began to decre .. weiterlesen

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As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC .. weiterlesen

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Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly emerging and pivotal technology for the PCB industry,perhaps preceded only .. weiterlesen

Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega .. weiterlesen

A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r .. weiterlesen

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Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures .. weiterlesen

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug .. weiterlesen

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This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric .. weiterlesen

Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics industries. Changes that demand common and pervasive requirements for active assemblies such .. weiterlesen

New component packaging formats create the need for greater production process stability,reproducibility and precision. This leads to a growing demand for process control solutions. As manufact .. weiterlesen

Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to aligning product requirements and industry capability. Statistical based chara .. weiterlesen

Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation .. weiterlesen

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Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where reliability,size and weight were at a premium,and cost was a secondary considerati .. weiterlesen

Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals used in printed wiring assemblies. The transition to the new printed wiri .. weiterlesen

With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are expecting chemical suppliers to formulate lead free alternatives with the same .. weiterlesen