CAF Test Vehicle Artworks within TM-650
The decision of which test vehicle artwork to use for CAF testing is made by the user after examining and understanding the test method 2.6.25.
SECTION 2.3 - 2.3 Chemical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.3.43.1 | Exposure to Sweat and Perspiration for E-Textiles 04/25 |
| TM 2.3.43.2 | Spotting to Acid for E-Textiles 04/25 |
| TM 2.3.43.3 | Exposure to Water and Saltwater for E-Textiles 04/25 |
| TM 2.3.43.4 | Spotting to Alkali for E-Textiles 04/25 |
| TM 2.3.43 | E-Textiles Washing and Drying 04/25 |
| TM 2.3.44.1 | Exposure to Sweat and Perspiration for Conducive Yarn 06/25 |
| TM 2.3.44.3 | Exposure to Acid for Conductive Yarn 06/25 |
| TM 2.3.44.2 | Exposure to Alkali for Conductive Yarn 06/25 |
| TM 2.3.44 | Exposure to Water and Salt Water for Conductive Yarn 06/25 |
SECTION 2.4 - 2.4 Mechanical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.4.55 | Abrasion Resistance of E-Textiles 04/25 |
| TM 2.4.56.2 | Torsion Duration of E-Textiles 04/25 |
| TM 2.4.56.1 | Stretch Durability of E-Textiles 04/25 |
| TM 2.4.56.3 | Bending Durability of E-Textiles 04/25 |
| TM 2.4.56.4 | Flexing Durability of E-Textiles 04/25 |
| TM 2.4.56 | Tensile Behavior of E-Textiles 04/25 |
SECTION 2.5 - 2.5 Electrical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.5.4.2 | Conductor Temperature Rise Due to Current Changes in Conductors for Printed Conductor Materials on Textiles 08/23 |
| TM 2.5.7.4 | High Voltage Moisture and Insulation Resistance Test of Fabricated Printed Board Test Patterns 09/23 |
| TM 2.5.3.7 | Electrical Resistance and Sheet Resistance of E-Textiles – Instrumental Assessment of Conductive Threads and Tracks 04/25 |
| TM 2.5.39 | Linear Electrical Resistance, Conductive Yarn – Four-Wire Method 06/25 |
| TM 2.5.38 | Fusing Current for Conductive Yarn 06/25 |
SECTION 2.6 - 2.6 Environmental Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.6.29.1 | UV Radiation Exposure of E-Textiles 04/25 |
| TM 2.6.29 | Climate Exposure of E-Textiles (Temperature and Moisture) 04/25 |
| TM 2.6.32 | Climate Exposure of Conductive Yarn Used in E-Textiles Applications (Temperature and Moisture) 06/25 |
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
| Test Method # | Titel |
|---|---|
| TM 1.1C | Introduction 01/03 |
| TM 1.2A | Calibration 01/03 |
| TM 1.3A | Ambient Conditions 01/03 |
| TM 1.4A | Reporting, General 01/03 |
| TM 1.5A | Reporting, Format 01/03 |
| TM 1.6A | Numerical Reporting 01/03 |
| TM 1.7A | Reporting, Invalid Test Results 01/03 |
| TM 1.8A | Measurement Precision Estimation for Binary Data 01/03 |
| TM 1.9A | Measurement Precision Estimation for Variables Data 01/03 |
SECTION 2.1 - 2.1 Visual Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.1.1F | Microsectioning, Manual and Semi or Automatic 06/15 |
| TM 2.1.2A | Pinhole Evaluation, Dye Penetration Method 03/76 |
| TM 2.1.3A | Plated-Through Hole Structure Evaluation 08/76 |
| TM 2.1.5A | Surface Examination, Unclad and Metal-Clad Material 12/82 |
| TM 2.1.6B | Thickness of Glass Fabric 12/94 |
| TM 2.1.6.1 | Weight of Fabric Reinforcements 12/94 |
| TM 2.1.7C | Thread Count of Glass Fabric 12/94 |
| TM 2.1.7.1 | Thread Count, Organic Fibers 12/87 |
| TM 2.1.8B | Workmanship 12/94 |
| TM 2.1.9 | Surface Scratch Examination Metal-Clad Foil 05/86 |
| TM 2.1.10A | Visual Inspection for Undissolved Dicyandiamide 12/94 |
| TM 2.1.13B | Inspection for Voids in Flexible Printed Board Materials 05/12 |
SECTION 2.2 - 2.2 Dimensional Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.2.1A | Mechanical Dimensional Verification 08/97 |
| TM 2.2.2B | Optical Dimensional Verification 08/97 |
| TM 2.2.4C | Dimensional Stability, Flexible Dielectric Materials 05/98 |
| TM 2.2.5A | Dimensional Inspections Using Microsections 08/97 |
| TM 2.2.6A | Hole Size Measurement, Drilled 08/97 |
| TM 2.2.7A | Hole Size Measurement, Plated 05/86 |
| TM 2.2.12A | Thickness of Copper by Weight 03/76 |
| TM 2.2.12.1 | Overall Thickness and Profile Factor of Copper Foils Treated and Untreated 09/87 |
| TM 2.2.12.2 | Weight and Thickness of Copper Foils with Releasable Carriers 07/89 |
| TM 2.2.12.3 | Weight and Thickness Determination of Copper Foils With Etchable Carriers 07/89 |
| TM 2.2.13.1A | Thickness, Plating in Holes, Microhm Method 01/83 |
| TM 2.2.14 | Solder Powder Particle Size Distribution - Screen Method for Types 1-4 01/95 |
| TM 2.2.14.1 | Solder Powder Particle Size Distribution - Measuring Microscope Method 01/95 |
| TM 2.2.14.2 | Solder Powder Particle Size Distribution - Optical Image Analyzer Method 01/95 |
| TM 2.2.14.3 | Determination of Maximum Solder Powder Particle Size 01/95 |
| TM 2.2.17A | Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) 02/01 |
| TM 2.2.18 | Determination of Thickness of Laminates by Mechanical Measurement 12/94 |
| TM 2.2.18.1 | Determination of Thickness of Metallic Clad Laminates, Cross-sectional 12/94 |
| TM 2.2.19.1 | Length, Width and Perpendicularity of Laminate and Prepreg Panels 12/94 |
| TM 2.2.20 | Solder Paste Metal Content by Weight 01/95 |
| TM 2.2.21 | Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology 11/98 |
| TM 2.2.22 | Noncontact Metallic Foil Surface Topography/Texture 08/20 |
SECTION 2.3 - 2.3 Chemical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.3.44 | Determination of Thickness and Phosphorus Content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry 11/17 |
| TM 2.3.25D | Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE) 11/12 |
| TM 2.3.28B | Ionic Analysis of Circuit Boards, Ion Chromatography Method 11/12 |
| TM 2.3.1 | Chemical Processing, Suitable Processing Material 04/73 |
| TM 2.3.1.1B | Chemical Cleaning of Metal-Clad Laminate 05/86 |
| TM 2.3.2G | Chemical Resistance of Flexible Printed Board Materials 12/07 |
| TM 2.3.4B | Chemical Resistance, Marking Paints and Inks 08/87 |
| TM 2.3.4.2A | Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure 12/94 |
| TM 2.3.4.3 | Chemical Resistance of Core Materials to Methylene Chloride 05/86 |
| TM 2.3.6A | Etching Ammonium Persulfate Method 07/75 |
| TM 2.3.7A | Etching, Ferric Chloride Method 07/75 |
| TM 2.3.7.1A | Cupric Chloride Etching Method 12/94 |
| TM 2.3.7.2A | Alkaline Etching Method 12/94 |
| TM 2.3.9D | Flammability of Prepreg and Thin Laminate 08/97 |
| TM 2.3.10B | Flammability of Laminate 12/94 |
| TM 2.3.10.1 | Flammability of Soldermask on Printed Wiring Laminate 08/98 |
| TM 2.3.11 | Glass Fabric Construction 04/73 |
| TM 2.3.13A | Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods 06/04 |
| TM 2.3.14 | Print, Etch, and Plate Test 04/73 |
| TM 2.3.15D | Purity, Copper Foil or Plating 05/04 |
| TM 2.3.16B | Resin Content of Prepreg, by Burn-off 12/94 |
| TM 2.3.16.1C | Resin Content of Prepreg, by Treated Weight 12/94 |
| TM 2.3.16.2 | Treated Weight of Prepreg 12/94 |
| TM 2.3.17D | Resin Flow Percent of Prepreg 08/97 |
| TM 2.3.17.2B | Resin Flow of "No Flow" Prepreg 08/97 |
| TM 2.3.18A | Gel Time, Prepreg Materials 04/86 |
| TM 2.3.19C | Volatile Content of Prepreg 12/94 |
| TM 2.3.21A | Plating Quality Hull Cell Method 08/97 |
| TM 2.3.22 | Copper Protective Coating Quality 02/78 |
| TM 2.3.24 | Porosity of Gold Plating 02/78 |
| TM 2.3.24.1 | Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method 10/85 |
| TM 2.3.24.2A | Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) 08/97 |
| TM 2.3.25.1 | Ionic Cleanliness Testing of Bare PWBs 10/00 |
| TM 2.3.28.1 | Halide Content of Soldering Fluxes and Pastes 06/04 |
| TM 2.3.28.2 | Bare Printed Board Cleanliness by Ion Chromatography 12/09 |
| TM 2.3.30A | Solvent pH Determination in Anhydrous Fluorocarbon Solvents 11/81 |
| TM 2.3.32D | Flux Induced Corrosion (Copper Mirror Method) 06/04 |
| TM 2.3.33D | Presence of Halides in Flux, Silver Chromate Method 06/04 |
| TM 2.3.34C | Solids Content, Flux 06/04 |
| TM 2.3.34.1B | Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder 01/95 |
| TM 2.3.35C | Halide Content, Quantitative (Chloride and Bromide) 06/04 |
| TM 2.3.35.1A | Fluorides by Spot Test, Fluxes - Qualitative 06/04 |
| TM 2.3.35.2A | Fluoride Concentration, Fluxes - Quantitative 06/04 |
| TM 2.3.36 | Acid Acceptance of Chlorinated Solvents 10/85 |
| TM 2.3.37B | Volatile Content of Adhesive Coated Dielectric Films 05/98 |
| TM 2.3.40 | Thermal Stability 07/95 |
| TM 2.3.41 | Test Method for Total Halogen Content in Base Materials 04/06 |
| TM 2.3.42 | Solder Mask - Resistance to Solvents and Cleaning Agents 03/07 |
| TM 2.3.17.1B | Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films 05/98 |
SECTION 2.4 - 2.4 Mechanical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.4.53 | Dye and Pull Test Method (Formerly Known as Dye and Pull) 08/17 |
| TM 2.4.1E | Adhesion, Tape Testing 05/04 |
| TM 2.4.1.5A | Determination of Treatment Transfer 05/95 |
| TM 2.4.1.6 | Adhesion, Polymer Coating 07/95 |
| TM 2.4.2A | Ductility of Copper Foil 03/76 |
| TM 2.4.2.1D | Flexural Fatigue and Ductility, Foil 03/91 |
| TM 2.4.3.1C | Flexural Fatigue and Ductility, Flexible Printed Wiring 03/91 |
| TM 2.4.3.2C | Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics 03/91 |
| TM 2.4.4B | Flexural Strength of Laminates (at Ambient Temperature) 12/94 |
| TM 2.4.4.1A | Flexural Strength of Laminates (at Elevated Temperature) 12/94 |
| TM 2.4.5.1 | Flexibility - Conformal Coating 07/00 |
| TM 2.4.6 | Hot Oil 04/73 |
| TM 2.4.7A | Machinability, Printed Wiring Materials 07/75 |
| TM 2.4.7.1 | Solder Mask - Determination of Machineability 03/07 |
| TM 2.4.8C | Peel Strength of Metallic Clad Laminates 12/94 |
| TM 2.4.8.1 | Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) 01/86 |
| TM 2.4.8.2A | Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) 12/94 |
| TM 2.4.8.3A | Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) 12/94 |
| TM 2.4.8.4 | Carrier Release, Thin Copper 01/90 |
| TM 2.4.9.1 | Peel Strength of Flexible Circuits 11/98 |
| TM 2.4.9.2 | Bonding Process 11/98 |
| TM 2.4.12A | Solderability, Edge Dip Method 06/91 |
| TM 2.4.13F | Solder Float Resistance Flexible Printed Wiring Materials 05/98 |
| TM 2.4.13.1 | Thermal Stress of Laminates 12/94 |
| TM 2.4.14.2A | Liquid Flux Activity, Wetting Balance Method 06/04 |
| TM 2.4.15A | Surface Finish, Metal Foil 03/76 |
| TM 2.4.17 | Tear Strength (Propagation) 04/73 |
| TM 2.4.18B | Tensile Strength and Elongation, Copper Foil 08/80 |
| TM 2.4.18.1A | Tensile Strength and Elongation, In-House Plating 05/04 |
| TM 2.4.18.2 | Hot Rupture Strength, Foil 07/89 |
| TM 2.4.18.3 | Tensile Strength, Elongation, and Modulus 07/95 |
| TM 2.4.19C | Tensile Strength and Elongation, Flexible Printed Wiring Materials 05/98 |
| TM 2.4.21F | Land Bond Strength, Unsupported Component Hole 01/07 |
| TM 2.4.22C | Bow and Twist (Percentage) 06/99 |
| TM 2.4.22.1C | Bow and Twist-Laminate 05/93 |
| TM 2.4.22.2 | Substrate Curvature: Silicon Wafers with Deposited Dielectrics 07/95 |
| TM 2.4.23 | Soldering Resistance of Laminate Materials 03/79 |
| TM 2.4.24C | Glass Transition Temperature and Z-Axis Thermal Expansion by TMA 12/94 |
| TM 2.4.24.1 | Time to Delamination (TMA Method) 12/94 |
| TM 2.4.24.2 | Glass Transition Temperature of Organic Films - DMA Method 07/95 |
| TM 2.4.24.3 | Glass Transition Temperature of Organic Films - TMA Method 07/95 |
| TM 2.4.24.4 | Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method 11/98 |
| TM 2.4.24.5 | Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method 11/98 |
| TM 2.4.24.6 | Decomposition Temperature (Td) of Laminate Material Using TGA 04/06 |
| TM 2.4.25D | Glass Transition Temperature and Cure Factor by DSC 11/17 |
| TM 2.4.26 | Tape Test for Additive Printed Boards 03/79 |
| TM 2.4.27.1B | Abrasion (Taber Method) Solder Mask and Conformal Coating 01/95 |
| TM 2.4.28.1F | Solder Mask Adhesion - Tape Test Method 03/07 |
| TM 2.4.29C | Adhesion, Solder Mask, Flexible Circuit 03/07 |
| TM 2.4.30 | Impact Resistance, Polymer Film 10/86 |
| TM 2.4.34 | Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95 |
| TM 2.4.34.1 | Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) 01/95 |
| TM 2.4.34.2 | Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) 01/95 |
| TM 2.4.34.3 | Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose) 01/95 |
| TM 2.4.34.4 | Paste Flux Viscosity - T-Bar Spindle Method 01/95 |
| TM 2.4.35 | Solder Paste - Slump Test 01/95 |
| TM 2.4.36C | Rework Simulation, Plated-Through Holes for Leaded Components 05/04 |
| TM 2.4.38A | Prepreg Scaled Flow Testing 06/91 |
| TM 2.4.39A | Dimensional Stability, Glass Reinforced Thin Laminates 02/86 |
| TM 2.4.40 | Inner Layer Bond Strength of Multilayer Printed Circuit Boards 10/87 |
| TM 2.4.41 | Coefficient of Linear Thermal Expansion of Electrical Insulating Boards 03/86 |
| TM 2.4.41.1A | Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method 08/97 |
| TM 2.4.41.2A | Coefficient of Thermal Expansion - Strain Gage Method 05/04 |
| TM 2.4.41.3 | In-Plane Coefficient of Thermal Expansion, Organic Films 07/95 |
| TM 2.4.41.4 | Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates 07/95 |
| TM 2.4.42 | Torsional Strength of Chip Adhesives 02/88 |
| TM 2.4.42.1 | High Temperature Mechanical Strength Retention of Adhesives 03/88 |
| TM 2.4.43 | Solder Paste - Solder Ball Test 01/95 |
| TM 2.4.44 | Solder Paste - Tack Test 03/98 |
| TM 2.4.45 | Solder Paste - Wetting Test 01/95 |
| TM 2.4.46A | Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms 06/04 |
| TM 2.4.47 | Flux Residue Dryness 01/95 |
| TM 2.4.48 | Spitting of Flux-Cored Wire Solder 01/95 |
| TM 2.4.49 | Solder Pool Test 01/95 |
| TM 2.4.50 | Thermal Conductivity, Polymer Films 07/95 |
| TM 2.4.51 | Self Shimming Thermally Conductive Adhesives 01/95 |
| TM 2.4.9E | Peel Strength, Flexible Dielectric Materials 06/14 |
| TM 2.4.52 | Fracture Toughness of Resin Systems for Base Materials 10/13 |
| TM 2.4.16B | Initiation Tear Strength, Flexible Insulating Materials 03/14 |
| TM 2.4.54 | Test Method for Thermal Transmission Properties of Metal Based Printed Boards (MBPB) 09/22 |
| TM 2.4.17.1C | Propagation Tear Strength, Flexible Insulating Material 04/23 |
| TM 2.4.3F | Flexural Endurance, Flexible Printed Board Materials 04/23 |
SECTION 2.5 - 2.5 Electrical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.5.5.14 | Measuring High Frequency Signal Loss and Propagation on Printed Boards with Frequency Domain Methods 03/21 |
| TM 2.5.34 | Power Density Rating for Embedded Resistors 07/12 |
| TM 2.5.1B | Arc Resistance of Printed Wiring Material 05/86 |
| TM 2.5.2A | Capacitance of Insulating Materials 07/75 |
| TM 2.5.3B | Current Breakdown, Plated Through-Holes 08/97 |
| TM 2.5.4.1A | Conductor Temperature Rise Due to Current Changes in Conductors 08/97 |
| TM 2.5.5.2A | Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method 12/87 |
| TM 2.5.5.3C | Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) 12/87 |
| TM 2.5.5.5C | Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band 03/98 |
| TM 2.5.5.5.1 | Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ 03/98 |
| TM 2.5.5.7A | Characteristic Impedance Lines on Printed Boards by TDR 03/04 |
| TM 2.5.5.9 | Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz 11/98 |
| TM 2.5.5.10 | High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials 07/05 |
| TM 2.5.5.11 | Propagation Delay of Lines on Printed Boards by TDR 04/09 |
| TM 2.5.5.12A | Test Methods to Determine the Amount of Signal Loss on Printed Boards 07/12 |
| TM 2.5.5.13 | Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator 01/07 |
| TM 2.5.6B | Dielectric Breakdown of Rigid Printed Wiring Material 05/86 |
| TM 2.5.6.1B | Solder Mask - Dielectric Strength 03/07 |
| TM 2.5.6.2A | Electric Strength of Printed Wiring Material 03/98 |
| TM 2.5.6.3 | Dielectric Breakdown Voltage and Dielectric Strength 10/86 |
| TM 2.5.7D | Dielectric Withstanding Voltage, PWB 05/04 |
| TM 2.5.7.1 | Dielectric Withstanding Voltage - Polymeric Conformal Coating 07/00 |
| TM 2.5.7.2A | Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards 11/09 |
| TM 2.5.10.1 | Insulation Resistivity for Adhesive Interconnection Bonds 11/98 |
| TM 2.5.12 | Interconnection Resistance, Multilayer Printed Wiring 04/73 |
| TM 2.5.13A | Resistance of Copper Foil 03/76 |
| TM 2.5.14A | Resistivity of Copper Foil 08/76 |
| TM 2.5.15A | Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable 10/86 |
| TM 2.5.17E | Volume Resistivity and Surface Resistance of Printed Wiring Materials 05/98 |
| TM 2.5.17.1A | Volume and Surface Resistivity of Dielectric Materials 12/94 |
| TM 2.5.17.2 | Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method 11/98 |
| TM 2.5.18B | Characteristic Impedance Flat Cables (Unbalanced) 07/84 |
| TM 2.5.19A | Propagation Delay of Flat Cables Using Time Domain Reflectometer 07/84 |
| TM 2.5.19.1A | Propagation Delay of Flat Cables Using Dual Trace Oscilloscope 07/84 |
| TM 2.5.21A | Digital Unbalanced Crosstalk, Flat Cable 03/84 |
| TM 2.5.27 | Surface Insulation Resistance of Raw Printed Wiring Board Material 03/79 |
| TM 2.5.30 | Balanced and Unbalanced Cable Attenuation Measurements 12/87 |
| TM 2.5.33 | Measurement of Electrical Overstress from Soldering Hand Tools 11/98 |
| TM 2.5.33.1 | Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements 11/98 |
| TM 2.5.33.2 | Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements 11/98 |
| TM 2.5.33.3 | Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements 11/98 |
| TM 2.5.33.4 | Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure 11/98 |
| TM 2.5.5.15 | Test Method for the Determination of Dk and Df by Split Post Dielectric Resonator (SPDR) 09/22 |
SECTION 2.6 - 2.6 Environmental Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.6.7.2C | Thermal Shock, Thermal Cycle and Continuity 03/20 |
| TM 2.6.26A | DC Current Induced Thermal Cycling Test 06/14 |
| TM 2.6.1G | Fungus Resistance Printed Wiring Materials 03/07 |
| TM 2.6.1.1 | Fungus Resistance – Conformal Coating 07/00 |
| TM 2.6.2.1A | Water Absorption, Metal Clad Plastic Laminates 05/86 |
| TM 2.6.3F | Moisture and Insulation Resistance, Printed Boards 05/04 |
| TM 2.6.3.1E | Solder Mask - Moisture and Insulation Resistance 03/07 |
| TM 2.6.3.3B | Surface Insulation Resistance, Fluxes 06/04 |
| TM 2.6.3.4A | Moisture and Insulation Resistance – Conformal Coating 07/03 |
| TM 2.6.3.5 | Bare Board Cleanliness by Surface Insulation Resistance 01/04 |
| TM 2.6.3.6 | Surface Insulation Resistance - Fluxes - Telecommunications 01/04 |
| TM 2.6.3.7 | Surface Insulation Resistance 03/07 |
| TM 2.6.4B | Outgassing, Printed Boards 05/04 |
| TM 2.6.5D | Physical Shock, Multilayer Printed Wiring 05/04 |
| TM 2.6.7.1A | Thermal Shock - Conformal Coating 07/00 |
| TM 2.6.7.3 | Thermal Shock - Solder Mask 07/00 |
| TM 2.6.8E | Thermal Stress, Plated-Through Holes 05/04 |
| TM 2.6.8.1 | Thermal Stress, Laminate 09/91 |
| TM 2.6.9B | Vibration, Rigid Printed Wiring 05/04 |
| TM 2.6.9.1 | Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy 01/95 |
| TM 2.6.9.2 | Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy 01/95 |
| TM 2.6.10A | X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods 08/97 |
| TM 2.6.11D | Solder Mask - Hydrolytic Stability 03/07 |
| TM 2.6.11.1 | Hydrolytic Stability - Conformal Coating 07/00 |
| TM 2.6.13 | Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring 10/85 |
| TM 2.6.14D | Solder Mask - Resistance to Electrochemical Migration 03/07 |
| TM 2.6.14.1 | Electrochemical Migration Resistance Test 09/00 |
| TM 2.6.15C | Corrosion, Flux 06/04 |
| TM 2.6.16 | Pressure Vessel Method for Glass Epoxy Laminate Integrity 07/85 |
| TM 2.6.16.1 | Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) 08/98 |
| TM 2.6.18A | Low Temperature Flexibility, Flexible Printed Wiring Materials 07/85 |
| TM 2.6.21B | Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films 06/11 |
| TM 2.6.23 | Test Procedure for Steam Ager Temperature Repeatability 07/93 |
| TM 2.6.24 | Junction Stability Under Environmental Conditions 11/98 |
| TM 2.6.28 | Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board 08/10 |
| TM 2.6.3.2C | Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material 08/15 |
| TM 2.6.27B | Thermal Stress, Convection Reflow Assembly Simulation 02/20 |
| TM 2.6.25C | Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis 06/21 |
| TM 2.6.2E | Moisture Absorption, Flexible Printed Wiring 04/23 |
SECTION 3.0 - 3.0 Connector Test Methods
| Test Method # | Titel |
|---|---|
| TM 3.1A | Contact Resistance, Connectors 07/75 |
| TM 3.2A | Contact Retention, Connectors 07/75 |
| TM 3.3A | Crimp Tensil Strength, Connectors 07/75 |
| TM 3.4B | Durability, Connectors 01/83 |
| TM 3.5A | Humidity, Connectors 07/75 |
| TM 3.6A | Insulation Resistance, Connectors 07/75 |
| TM 3.7A | Low Level Circuit Connectors 07/75 |
| TM 3.8A | Mechanical Shock, Connectors 07/75 |
| TM 3.9A | Salt Spray, Connectors 07/75 |
| TM 3.10A | Solderability, Connectors 07/75 |
| TM 3.11A | Thermal Shock, Connectors 07/75 |
| TM 3.12A | Vibration, Connectors 07/75 |
| TM 3.13A | Withstanding Voltage, Connectors 07/75 |
| TM 3.14 | High Temperature Life, Connectors 07/75 |
| TM 3.15 | Fungus Resistance, Connectors 07/79 |
| TM 3.16 | Fretting Corrosion, Connectors 02/78 |
| TM 3.17 | Industrial Gas Test (Battelle Method), Connectors 02/78 |
| TM 3.18 | Mating and Unmating Force, Connectors 01/83 |
SECTION 2.1 - 2.1 Visual Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.1.1.3 | Microsection Preparation for Microvia Structures 06/15 |
SECTION 2.3 - 2.3 Chemical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.3.8A | Flammability, Flexible Insulating Materials 12/82 |
SECTION 2.1 - 2.1 Visual Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.1.1.1 | Microsectioning, Ceramic Substrate 12/87 |
| TM 2.1.1.2A | Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate) 05/04 |
SECTION 2.2 - 2.2 Dimensional Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.2.8 | Location of Holes 04/73 |
| TM 2.2.10A | Hole Location and Conductor Location 12/83 |
| TM 2.2.15 | Cable Dimensions (Flat Cable) 06/79 |
| TM 2.2.16 | Artwork Master Evaluation by Use of a Drilled Panel 12/87 |
| TM 2.2.16.1 | Artwork Master Evaluation by Overlay 12/87 |
| TM 2.2.19 | Measuring Hole Pattern Location 12/87 |
SECTION 2.3 - 2.3 Chemical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.3.3A | Chemical Resistance of Insulating Materials 02/78 |
| TM 2.3.5B | Density, Insulating Material 08/97 |
| TM 2.3.8.1 | Flammability of Flexible Printed Wiring 12/88 |
| TM 2.3.23B | Cure (Permanency) Thermally Cured Solder Mask 02/88 |
| TM 2.3.23.1A | Cure (Permanency) UV Initiated Dry Film Solder Mask 02/88 |
| TM 2.3.26A | Superseded by Test Method 2.3.25 02/88 |
| TM 2.3.26.1 | Superseded by Test Method 2.3.25 02/88 |
| TM 2.3.27 | Cleanliness Test - Residual Rosin 01/95 |
| TM 2.3.27.1 | Rosin Flux Residue Analysis-HPLC Method 01/95 |
| TM 2.3.29 | Flammability, Flexible Flat Cable 11/88 |
| TM 2.3.31 | Relative Degree of Cure of U.V. Curable Material 02/88 |
| TM 2.3.38C | Surface Organic Contaminant Detection Test 05/04 |
| TM 2.3.39C | Surface Organic Contaminant Identification Test (Infrared Analytical Method) 05/04 |
| TM 2.3.25B | Detection and Measurement of Ionizable Surface Contaminants 08/97 |
| TM 2.3.26.2 | Mobile Ion Content of Polymer Films 07/95 |
SECTION 2.4 - 2.4 Mechanical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.4.1.1B | Adhesion, Marking Paints and Inks 11/88 |
| TM 2.4.1.2 | Adhesion of Conductors on Hybrid Substrates 12/87 |
| TM 2.4.1.3 | Adhesion, Resistors (Hybrid Circuits) 12/87 |
| TM 2.4.1.4 | Adhesion, Overglaze (Hybrid Circuits) 12/87 |
| TM 2.4.5 | Folding Endurance, Flexible Printed Wiring Materials 04/73 |
| TM 2.4.9D | Peel Strength, Flexible Dielectric Materials 10/88 |
| TM 2.4.11 | Shear Strength Flexible Dielectric Materials 04/73 |
| TM 2.4.14 | Solderability of Metallic Surfaces 04/73 |
| TM 2.4.14.1 | Solderability, Wave Solder Method 03/79 |
| TM 2.4.20 | Terminal Bond Strength, Flexible Printed Wiring 04/73 |
| TM 2.4.27.2A | Solder Mask Abrasion (Pencil Method) 02/88 |
| TM 2.4.28B | Adhesion, Solder Mask (Non-Melting Metals) 08/97 |
| TM 2.4.31A | Folding, Flexible Flat Cable 04/86 |
| TM 2.4.32A | Fold Temperature Testing, Flexible Flat Cable 04/86 |
| TM 2.4.33C | Flexural Fatigue and Ductility, Flat Cable 03/91 |
| TM 2.4.37A | Evaluation of Hand Soldering Tools for Terminal Connections 07/91 |
| TM 2.4.37.1A | Evaluation of Hand Soldering Tools for Printed Wiring Board Applications 07/91 |
| TM 2.4.37.2 | Evaluation of Hand Soldering Tools on Heavy Thermal Loads 07/93 |
| TM 2.4.42.2 | Die Shear Strength 03/18 |
| TM 2.4.42.3 | Wire Bond Pull Strength 03/18 |
| TM 2.4.10 | Plating Adhesion 04/73 |
SECTION 2.5 - 2.5 Electrical Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.5.7.2 | Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Circuit Boards (PCBs) 12/07 |
| TM 2.5.11 | Insulation Resistance, Multilayer Printed Wiring (Within a Layer) 04/73 |
| TM 2.5.4 | Current Carrying Capacity, Multilayer Printed Wring 04/73 |
| TM 2.5.5A | Dielectric Constant of Printed Wiring Materials 07/75 |
| TM 2.5.5.1B | Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems) 05/86 |
| TM 2.5.5.4 | Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method 10/85 |
| TM 2.5.5.6 | Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates 05/89 |
| TM 2.5.5.8 | Low Frequency Dielectric Constant and Loss Tangent, Polymer Films 07/95 |
| TM 2.5.8A | Dissipation Factor of Flexible Printed Wiring Material 07/75 |
| TM 2.5.16A | Shorts, Internal on Multilayer Printed Wiring 11/88 |
| TM 2.5.24 | Conductor Resistance, Flexible Flat Cable 06/79 |
| TM 2.5.25A | Dielectric Withstand Voltage Flexible Fat Cable 11/85 |
| TM 2.5.26A | Insulation Resistance Flexible Flat Cable 11/85 |
| TM 2.5.28A | Q Resonance, Flexible Printed Wiring Materials 04/88 |
| TM 2.5.31 | Current Leakage (Through Overglaze Films) 12/87 |
| TM 2.5.32 | Resistance Test, Plated Through-Holes 12/87 |
SECTION 2.6 - 2.6 Environmental Test Methods
| Test Method # | Titel |
|---|---|
| TM 2.6.7.1 | Thermal Shock - Conformal Coating 07/00 |
| TM 2.6.6B | Temperature Cycling, Printed Wiring Board 12/87 |
| TM 2.6.7A | Thermal Shock and Continuity, Printed Board 08/97 |
| TM 2.6.12 | Temperature Testing, Flexible Flat Cable 06/79 |
| TM 2.6.17 | Hydrolitic Stability, Flexible Printed Wiring Material 12/82 |
| TM 2.6.19 | Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards 12/87 |
| TM 2.6.20A | 2.6.20A 01/95 |
| TM 2.6.22 | 2.6.22 01/95 |
Test Methods Subcommittee - provides definitions associated with test methods
Cancelled Methods: A method that is no longer referenced in a current IPC specification, guidance document or whose scope is outdated for the evaluating modern electronic materials, processes or products. Additionally, a cancelled method may no longer have an Originating Task Group (OTG)
Archived Method: A method that is no longer referenced in a current IPC specification or guidance document but may still be used to meet legacy product requirements. Additionally, a archived method may no longer have an Originating Task Group (OTG)
Withdrawn Method: A method that was taken out of service by the Originating Task Group because it either did not meet validation requirements or the method was found to no longer be necessary.