IPC Hand Soldering Competition Winner Crowned at What's New in Electronics Live 2019
IPC, in conjunction with What’s New in Electronics Live and ART-- Advanced Rework Technology Ltd., conducted the IPC Hand Soldering Competition in Warwickshire, United Kingdom, on September 18-19, 2019. Twenty competitors demonstrated their soldering skills with the hope of winning the coveted hand soldering competition crown.
North American PCB Industry Turnaround Shown in New IPC Report
IPC’s 2019 Annual Report on the North American PCB Industry, published last week, shows that the PCB industry in North America has turned a corner. For the first time in five years, domestic PCB production grew in 2018. North America’s PCB market also grew last year by nearly eight percent, solidifying the turnaround that began in 2017.
M-EXPO Wire Processing Technology 2019 Exhibit Space Sold Out; Wait List Open
Exhibitor booth space at the third annual M-EXPO Wire Processing Technology 2019 in Ciudad Juárez, México, is sold out and wait-list applications are being accepted.M-EXPO 2019 has more than doubled its event space from 2018 and has exceeded expectations by selling out the exhibit space a month before the event. This year’s event is being held on October 9-11, 2019 at the Cuatro Siglos Convention Center, co-locating with the ninth annual EXPO-MRO.
IPC Designs for Excellence in Conjunction with PCB Carolina
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. Will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
B. Gentry Lee to Keynote 2020 WHMA 27th Annual Wire Harness Conference
B. Gentry Lee, chief engineer for the Solar System Exploration Directorate at the Jet Propulsion Laboratory (JPL) and successful science fiction writer, will present his keynote address, “A Passion for Space Exploration,” at the WHMA 27th Annual Wire Harness Conference, February 19, 2020, in Las Vegas, Nevada. During his keynote presentation, Lee will talk about the highlights of his exploration career and touch on the role of wires and harnesses on the most memorable spacecraft.