IPC Releases 2018 Quality Benchmark Study for Electronics Assembly
IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Electronics Industry Supports Senate Bill to Advance Workforce Education
IPC – Association Connecting Electronics Industries, the global industry association representing the $2 trillion global electronics industry, applauds a U.S. Senate committee for its work in advancing a workforce education and training bill.
IPC APEX EXPO 2019 … Exhibit Space Going Fast
IPC reports that 85 percent of exhibit floor space has been sold for IPC APEX EXPO® 2019. Three hundred twenty-seven exhibitors have been assigned to 134,200 net square feet of exhibit space, marking a 5 percent increase in square footage compared to 2018’s booth space selection event. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 29–31, 2019, at the San Diego Convention Center in San Diego, Calif.
IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13
IPC launched a global survey of printed circuit board (PCB) manufacturers in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for PCB fabricator survey responses is July 13.
IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.