Coronavirus Expected to Cause Five-Week Product Shipment Delays, Says Electronics Manufacturing Industry
Electronics manufacturers anticipate at least a five-week product shipment delay from suppliers due to the coronavirus epidemic, according to a survey conducted by IPC, a global electronics manufacturing association. The group says shipping delays from China and other countries where the virus has spread are already having negative impacts on manufacturers.
IPC Announces European Hand Soldering Competition Calendar
IPC will conduct regional hand soldering competitions for professionals in Europe along with the world hand soldering championship at Electronica Germany in November.
IPC Issues Call for Participation for IPC E-Textiles 2020 – Virtual Summit
IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts for IPC E-Textiles 2020 – Virtual Summit, to be held October 1-2, 2020. IPC E-Textiles 2020 – Virtual Summit will provide a platform for presenters and their companies to promote their expertise in e-textiles technologies to key contacts from such industries as fashion design, health and medical, sports and athletics, automotive and military/aerospace.
Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
IPC Calls for Participation in Electronics Materials Forum
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
IPC Issues Call for Participation for High Reliability Forum 2020
IPC and ANSYS invite engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the High Reliability Forum, to be held May 12-14, 2020 in Baltimore, Md.