Global Electronics Association Knowledge Hub

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad .. leer más

Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher frequency and higher power requirements. These power and frequency demands .. leer más

Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas .. leer más

In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli .. leer más

This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h .. leer más

• The Information Process • Knowing the jargon (terms & definitions) • Defining the requirements • Expansion of Documentation standards • Document Grade and Completeness • Relationship of CAD/C .. leer más

• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly. • Other areas covered include board base material type and sur .. leer más

Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal management. Conductor temperature rise as a function of current is depe .. leer más

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Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. leer más

In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains .. leer más

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to .. leer más

- Production Processes - Manual Production Line (2000) - Fully Automated System (today) - Cell Interconnection - Encapsulation Materials - Encapsulation Process - Influence of Temperature - Enc .. leer más

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With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive environments,the electronics industry is observing increased occurrences o .. leer más

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. leer más

Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a .. leer más

The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product .. leer más

This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials .. leer más

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days,components were fairly large,m .. leer más

Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics packaging design using smaller components with greater I/Os assembled .. leer más

Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also .. leer más

Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use .. leer más

Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr .. leer más

The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the .. leer más

The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o .. leer más

One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag .. leer más

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. leer más

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. leer más

An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame retardant epoxy resins use bromine-containing flame-retardants. In t .. leer más

Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto .. leer más

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro .. leer más

It is frequently noted in surface mount printed circuit board assembly that most solder defects can be traced back to the stencil printing process. In addition,continuous miniaturization trends .. leer más

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. leer más

Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The failure mechanisms and root causes are not yet fully understood,and l .. leer más

The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle .. leer más

The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that each new generation of products furnish greater functionality. The minia .. leer más

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. leer más

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensiv .. leer más

Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined .. leer más

Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo .. leer más

Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec .. leer más

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. leer más

Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a .. leer más

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. leer más

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In this presentation,numerous examples of counterfeited parts are provided along with the means of identification for the respective technique utilized in production. .. leer más

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This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t .. leer más

- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly .. leer más