Advanced Packaging: HDI Enabling Technology

Course meets Monday and Wednesday

In today's rapidly evolving technological landscape, the demand for smaller and more powerful electronic devices continues to grow. From smartphones to tablets, the drive for miniaturization is evident. However, there are underlying factors that contribute to this trend, which may not be immediately apparent.

Industries such as Military-Aerospace, Medical, Telecom, and Industrial Electronics rely on fine-pitch packages (QFPs and BGAs) and increased package pin counts to support their interconnect designs. To meet these demands, High-Density Interconnect (HDI) and Ultra High-Density Interconnect (UHDI) technologies play a critical role. When properly integrated into the PCB structure, HDI improves both signal integrity and via reliability. The success or failure of product performance, reliability, and time to market is heavily influenced by the materials, processes, and designs of these enabling technologies.

This course is perfect for PCB fabricators and end users that require an understanding of the constraints with respect to blind and filled vias, fine-pitch designs, material and foil types, stack-ups and reliability.