IMPACT 2025
Celebrate 20 years of pioneering innovation—
join us at IMPACT 2025!
Submit your abstract before June 20 2025
Accepted Papers Will Be included in IEEE Xplore !
Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability. Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications.
Now in its 20th year, IMPACT 2025 embraces the theme “Energy-Efficient AI: From Cloud to the Edge,” reflecting the industry’s growing emphasis on high-performance, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.
This milestone year marks not just a celebration of the past 20 years, but a bold step into the future, where IMPACT continues to lead, inspire, and drive innovation. Join us at IMPACT 2025 as we shape the next era of AI, semiconductor packaging, and PCB technology—powering a smarter, more sustainable world.
No.1, Jingmao 2nd Rd.
Nangang District, Taipei City 11568
Taiwan
Taipei Nangang Exhibition Center
Taipei Nangang Exhibition Center
No.1, Jingmao 2nd Rd.
Nangang District, TPE 11568
Taiwan