PBA: Designing for Assembly

Date
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All virtual class sessions are recorded for review.

SESSION 1 – COMPONENT PACKAGING AND PRINTED BOARD DESIGN

The class session will focus on component packaging and printed board design concepts.

Topics include:

  • DFM History Overview
  • Component Packaging Technology
  • Supplier Documentation Completeness and Accuracy
  • Printed Board Design and Fabrication
  • Printed Board Design and Supplier-Driven Assembly Issues
  • Assembly Tooling, Materials, and Process Design  
  • IPC Standards and Limitations

SESSION 2 – ASSEMBLY AND PROCESS DESIGN, TOLERANCE 

The class session will focus on assembly and process design/limitations, and assembly tolerance analysis.

Topics include:

  • Effects of Improper Assembly Tooling and Process Design
  • Impacts of Design on Process Control
  • PTH and SMT Thermal Connection and Non-STD Geometry Impacts
  • Design for Aqueous Cleaning Overview
  • Assembly Tolerance and Process Effects Analysis