Polymers in Advanced Packaging

Course meets Tuesday and Thursday

Taught by an industry expert with 40+ years of experience, this two-week program uses interactive webinars and on-demand recordings to develop a solid grasp of the concepts necessary for success as an advanced packaging engineer or product development professional. Advanced Packaging: Introduction to Polymers introduces the types of polymers and polymer composites used in advanced packaging applications.

Topics will include:

Introduction to advanced packaging, package types, and trends in packaging architecture.
High-density interconnect (HDI) laminates and substrates, build-up film substrates, and advanced laminates for 5G mobile applications.
Overview of polymers used in electronic packaging.
Key polymer properties, such as the glass transition temperature, coefficient of thermal expansion, modulus, and rheological properties.
High-density interconnect (HDI) materials and process.
Build up films (chemistry, process, properties).
Low dielectric constant and low dielectric loss materials and applications, such as antenna in package (AIP).