Reliability of Electronics - Role of Solder Joint Voids
Date
As miniaturization and advanced packaging techniques push the boundaries of design, understanding and mitigating solder joint voids is essential for engineers, designers, and manufacturing professionals.
Course Highlights:
- Identify key causes and effects of solder joint voids
- Explore best practices to minimize voids and improve product reliability
- Learn from real-world case studies and industry standards (IPC-J-STD-001, IPC-A-610, IPC-7093, IPC-7095)
- Engage with industry-leading knowledge and apply it to your own manufacturing challenges