Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. read more