Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more