Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. read more
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. read more
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. read more
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. read more
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves
Moore’s Law infers that the number of transistors on a chip doubles approximately every two years. Consistent with Moore’s Law,high reliability electronic devices build faster processing speed
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. read more