Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. read more
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Dual Solvent Electronic Assembly Cleaning
Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati
.. read more
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
PCB Manufacturing for Electronics Megatrends
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be
.. read more
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Micro Trace Resistive Technology
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Dual Solvent Electronic Assembly Cleaning
Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati
.. read more
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more