Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. read more
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. read more
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. read more