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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. read more
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance
From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou
.. read more
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re
.. read more
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance
From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou
.. read more
Assembly Cleanliness and Whisker Formation
This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH)
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved.
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more