Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
ABILITY OF INDUSTRY RELIABILITY METHODOLOGIES TO PREDICT LIFECYCLE APPLICATION FIELD FAILURES
Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. As consumers dem
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more