Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. read more
QFN Voiding Control Via Solder Mask Patterning On Thermal Pad
•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via
•Divided thermal pad preferred,with SMD better than NSMD
•This work focus on systematic study on effect of S
.. read more
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more
Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. read more
QFN Voiding Control Via Solder Mask Patterning On Thermal Pad
•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via
•Divided thermal pad preferred,with SMD better than NSMD
•This work focus on systematic study on effect of S
.. read more
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres
Board-level drop test performance was evaluated and compared for the following four different solder combinations in
BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Void or Not to Void
- Background: What is a void?
- What is a "macro" void?
- What is a “planar” void?
- What is a “shrinkage” void?
- What is a “microvia” void?
- What is a “pinhole” void?
- What is a “Kirkendall
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Robust Automated Void Detection in Solder Balls and Joints
Accuracy in solder balls and joint void detection is very important. If voids are incorrectly identified,board yield will be affected by incorrect scrapping and rework. Voids are difficult to d
.. read more