Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Simulation of Resonance Reduction in PCBs Utilizing Embedded Capacitance
The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a
.. read more
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. read more
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Simulation of Resonance Reduction in PCBs Utilizing Embedded Capacitance
The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a
.. read more
Novel Substrate for Use as Embedded Capacitance: An Easy to Process Higher Dk Material
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled
and filled materials were characterized in regards to performance,reliabi
.. read more
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more