Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions
A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign,
organic-based solutions as the plating bath is being investigated. The plat
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
High Phosphorus ENIG – Highest Resistance Against Corrosive Environment
Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a
final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions
A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign,
organic-based solutions as the plating bath is being investigated. The plat
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
High Phosphorus ENIG – Highest Resistance Against Corrosive Environment
Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a
final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more