Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more