Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Physical Implementation of the High-Speed Design Process
Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints
defined by engineering and create a layout that adheres to those design
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more
The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Physical Implementation of the High-Speed Design Process
Layout designers play a critical role in the design of high-speed circuits. In an optimized process,they take constraints
defined by engineering and create a layout that adheres to those design
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more