Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Cone vs. Fan Nozzles: Practical Aspects for Spray Processing of High Density Circuits
Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the
industry today. However,as line and space requirements fall below 4 mils (100µm
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Cone vs. Fan Nozzles: Practical Aspects for Spray Processing of High Density Circuits
Horizontal conveyorized spray processing is the most prevalent method for the production of circuit panels in the
industry today. However,as line and space requirements fall below 4 mils (100µm
.. read more