Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Perspectives on Repaired Lead-Free Solder Joints
The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability
applications has a number of technical challenges unique to the indus
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Practical Implementation of Lead-Free Soldering The Experience of the Japanese Electronics Industry
With the US military now committed to the phasing
out of lead-containing solders via the Joint Group on
Pollution Prevention (JG-PP) the electronics industry
has moved beyond debate about wheth
.. read more
Effects of Lead-Free Surface Finishes on Press-Fit Connections
For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of
printed circuit board (PCB) in press-fit connections. Therefore,most test r
.. read more
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. read more
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Perspectives on Repaired Lead-Free Solder Joints
The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability
applications has a number of technical challenges unique to the indus
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Practical Lead-Free Implementation
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that
many electronics assemblers will be transitioning their soldering proces
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance
Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring
the product has sufficient thermal stability. Lead is most commonly
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Practical Implementation of Lead-Free Soldering The Experience of the Japanese Electronics Industry
With the US military now committed to the phasing
out of lead-containing solders via the Joint Group on
Pollution Prevention (JG-PP) the electronics industry
has moved beyond debate about wheth
.. read more
Effects of Lead-Free Surface Finishes on Press-Fit Connections
For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of
printed circuit board (PCB) in press-fit connections. Therefore,most test r
.. read more
Reduction of Hazardous Substances vs. Recycling
Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as
lead or halogens. The unintended consequences are huge in terms of diversion of reso
.. read more
Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls
Although wave soldering has not historically been considered a well-controlled process,its evolution over the past
decade makes it a prime candidate for effective control methods. These methods
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more